Offset Sensor Header Pins Prevent Dislodgment Under High Pressure
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Solution Overview
Problem
Traditional high-pressure sensor headers face reliability issues due to limitations in pressure and stress handling, leading to dislodged header pins and open circuits when exposed to extreme pressures, as glass-to-metal sealing and brazing technologies are insufficient for ultra-high-pressure environments.
Innovation Solution
A sensor header assembly is designed with axially offset through holes and depressions in ceramic layers, providing support surfaces for header pins and ensuring reliable electrical connections through braze seals and metalized vias, enhancing the structural integrity and pressure handling capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If glass-to-metal sealing or ceramic-to-metal brazing is used to secure header pins, then electrical interconnections are established, but the header pins dislodge and create open circuits under extreme high-pressure conditions
Solution Approach 1:
The header is divided into multiple layers (first header layer, second header layer, third header layer) with each layer providing specific functions. The header pins are segmented to extend through specific layers and are supported by support structures at different levels, distributing the mechanical stress and preventing dislodgment under high pressure.
Solution Approach 2:
The invention introduces axial offset between through-holes in different header layers, creating a three-dimensional configuration rather than a simple planar arrangement. This axial offset, combined with support surfaces, provides multi-dimensional constraint that prevents header pin dislodgment in high-pressure environments.
2Ease of manufacture
If traditional sealing methods are used, then electrical connections are made, but the connections fail under extreme pressure and stress levels
Solution Approach 1:
Support structures and support surfaces are pre-formed in the header layers before header pins are inserted. This preliminary preparation ensures that when header pins are secured through brazing or sealing, they immediately have structural support to prevent dislodgment, combining ease of manufacture with high reliability.
Solution Approach 2:
The header assembly uses composite construction combining ceramic or glass materials for the header layers with metal header pins and support structures. This composite approach leverages the electrical conductivity of metals and the pressure resistance of ceramics/glass to achieve both ease of manufacturing connections and reliability under stress.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves the reliability and stability of sensor headers in high-pressure environments by supporting header pins and maintaining electrical connections, preventing pin dislodgment and open circuits, thus enhancing the overall performance of sensor devices.
Implementation Method 1
Traditional high-pressure sensor headers are typically constructed utilizing glass to metal seals and/or ceramic to metal brazing to secure and seal electrical interconnection pins to a header shell
Data Source
AI summary
Header construction and techniques are disclosed that utilize header layers that provide support for electrical interconnections. A sensor header assembly includes: an upper header layer having upper through holes arranged in a first configuration; a lower header layer having lower through holes arranged in a second configuration axially offset relative to the first configuration; depressions extending from the lower header layer top surface and partially through the lower header layer, each depression defining a footprint corresponding to the first configuration of the corresponding upper through holes of the upper header layer; upper header pins extending through the corresponding upper through holes and at least partially into the corresponding lower level depressions; and lower header pins extending through the corresponding lower through holes and in electrical communication with the corresponding upper header pins. The depressions form support surfaces for supporting at least the corresponding upper header pins during high-pressure operation.