Offset Spring for Small Form Factor Pressure Sensor Pad Connection
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Solution Overview
Problem
Existing small form factor pressure sensors face challenges in making offset pad connections due to spatial constraints, particularly in minimizing the radial distance of sensor PCB contact pads from the center to enable wirebonding to a strain gage.
Innovation Solution
The use of offset springs with coiled sections, where the center section is offset to facilitate contact between two electrical contact pads, allowing for efficient alignment and connection within the constrained space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single PCB is used to minimize component count, then device complexity is reduced, but making offset pad connections becomes difficult due to spatial constraints
Solution Approach 1:
The patent introduces a spring as an intermediary component between the PCB contact pads and the wirebonding area. This spring enables electrical connection while accommodating the spatial offset between pads, thus maintaining the single-PCB simple structure while solving the connection difficulty.
2Length of moving object
If PCB contact pads are placed at minimum radial distance from center, then wirebonding to strain gage is enabled, but offset pad connection becomes constrained
Solution Approach 1:
The patent resolves the two-dimensional planar constraint by introducing a third dimension - the spring's vertical deflection and coil structure. This allows the spring to bridge the radial offset between contact pads while maintaining compact radial footprint, enabling connection where direct planar contact would fail.
3Ease of operation
If spring is used to make offset contact, then ease of operation for pad connection is improved, but device complexity increases
Solution Approach 1:
The spring serves multiple functions simultaneously: it provides electrical connection, accommodates radial offset, enables mechanical compliance, and maintains electrical contact pressure. This multi-functionality justifies the added component by eliminating the need for separate structures for each function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables reliable and efficient offset contact between electrical contact pads, improving the assembly and performance of small form factor pressure sensors by optimizing the use of space and enhancing electromagnetic compatibility without reducing the available PCB area.
Implementation Method 1
a spring having first and second coiled sections offset by a coiled center section in a middle that is used to make offset contact between two electrical contact pads
Data Source
AI summary
A small form factor Microfused Silicon Strain gage (MSG) sensor incorporates an offset spring and feed-in features. A pressure sensor includes a spring having first and second coiled sections offset by a coiled center section in a middle that is used to make offset contact between two electrical contact pads.