Offset Stacked CAMM With Z-Axis Compression Connectors

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Solution Overview

Problem

Existing information handling systems face challenges in efficiently processing and storing data due to congestion and increased power requirements in memory channel routing, particularly with multiple Small Outline Dual In-Line Memory Modules (SODIMMs) connected in series.

Innovation Solution

The implementation of a Compression Attached Memory Module (CAMM) with a z-axis compression connector that allows for offset stacking, reducing the need for multiple connectors and minimizing signal trace crossings, thereby improving data transfer rates and reducing power consumption.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If multiple SODIMMs are connected in series to increase memory capacity, then memory capacity increases, but signal trace congestion and power requirements increase

Engineering Contradiction:

Improvememory capacityVSAvoidsignal trace congestion

Core Design Contradiction:

Quantity of substanceVSDevice complexity

Solution Approach 1:

The patent transitions from planar (2D) SODIMM connections to vertical (3D) stacked CAMM connections. Multiple memory channels are routed through compression contact pads that extend in the z-axis direction, allowing signals to travel vertically rather than horizontally across the PCB. This dimensional change eliminates trace congestion by using the vertical space above and below the PCB surface for signal routing.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The compression connector structure embeds multiple memory channels within a single connector assembly. The first and second compression contact pad arrays are nested within the same connector housing, with the second array positioned adjacent to and coupled with the first array. This nesting allows multiple channels to share the same physical space without requiring separate connector assemblies for each channel.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Quantity of substance

If multiple SODIMMs are connected in series to increase memory capacity, then memory capacity increases, but power consumption increases

Engineering Contradiction:

Improvememory capacityVSAvoidpower consumption

Core Design Contradiction:

Quantity of substanceVSUse of energy by stationary object

Solution Approach 1:

The patent merges multiple memory channels into a single compression connector assembly. The first and second compression contact pad arrays are combined within one connector, sharing common signal routing paths and power delivery infrastructure. This consolidation reduces the total number of separate connections required, thereby reducing overall power consumption while maintaining increased memory capacity through the stacked configuration.

Inventive Principle:

Principle #5Merging (Combining)

3Adaptability or versatility

If traditional memory connectors are used, then compatibility is maintained, but reversibility and routing flexibility are limited

Engineering Contradiction:

Improverouting flexibilityVSAvoidreversibility

Core Design Contradiction:

Adaptability or versatilityVSEase of operation

Solution Approach 1:

The compression connector is designed with universal functionality to support multiple memory channel configurations. The first and second compression contact pad arrays can be coupled in various orientations and configurations, allowing the same connector type to serve different routing needs. This multi-functionality enables flexible memory channel routing while maintaining compatibility with existing CAMM form factors.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS12298923B2Compression attached memory module for offset stacking

Publication Date: 2025.05.13 DELL PROD LP

AI summary

A compression attached memory module (CAMM) includes a memory device, a first array of compression contact pads and a second array of compression contact pads. The first array of compression contact pads receives a first memory channel and a second memory channel. The first memory channel is coupled to the first memory device. The second array of compression contact pads is coupled to a subset of the first compression contact pads associated with the second memory channel.