Offset Stacked IC Package Reducing Height Without Spacers
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Solution Overview
Problem
Existing integrated circuit package technologies face challenges in reducing package dimensions, manufacturing costs, and improving yields due to the need for increased integration of circuits in a shrinking physical space, with current spacers and stacking methods increasing complexity and costs.
Innovation Solution
A stacked integrated circuit package-in-package system is implemented using an offset configuration where the second integrated circuit package is stacked on the first with exposed peripheral contacts, eliminating the need for spacers and allowing thinner adhesives and larger interconnect loop heights, thereby reducing package height and manufacturing steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If spacers are used to connect stacked integrated circuits, then electrical connections are established, but manufacturing complexity and cost increase while yields decrease
Solution Approach 1:
The patent removes the spacer component entirely from the stacked integrated circuit structure. Instead of using spacers to provide mechanical support and electrical connections, the invention directly connects integrated circuits to the package substrate through wire bonds, eliminating the spacer and its associated manufacturing complexity and cost issues while maintaining reliable electrical connections
Solution Approach 2:
The patent introduces wire bonds as an intermediary element to establish electrical connections between the stacked integrated circuits and the package substrate. These wire bonds replace the complex spacer structure, providing a simpler and more cost-effective method for achieving reliable electrical connectivity in the stacked configuration
2Stability of the object's composition
If spacers are used in stacked integrated circuits, then structural support is provided, but package height increases
Solution Approach 1:
The patent eliminates the spacer structure that was previously used to provide mechanical support in stacked integrated circuits. By removing the spacer, the overall package height is reduced while structural stability is maintained through alternative support mechanisms integrated into the package substrate and circuit board assembly
3Adaptability or versatility
If more integrated circuits are integrated into each circuit, then functionality increases, but physical space requirements are not reduced
Solution Approach 1:
The patent transitions from a planar arrangement of integrated circuits to a three-dimensional stacked configuration. By stacking multiple integrated circuits vertically on top of each other, the system achieves higher functionality and integration density without increasing the horizontal footprint, effectively utilizing the vertical dimension to reduce overall package area
Data Source
AI summary
A stacked integrated circuit package-in-package system is provided forming a first integrated circuit package having a first peripheral contact, forming a second integrated circuit package having a second peripheral contact, stacking the second integrated circuit package on the first integrated circuit package in an offset configuration with the first peripheral contact exposed, the offset configuration provides a second package overhang with the second integrated circuit package above the first integrated circuit package, electrically connecting the first peripheral contact and a package substrate top contact, and electrically connecting the second peripheral contact and the package substrate top contact.