Offset Thin-Film Transistor Layout to Eliminate Overlap Capacitance

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

In thin film transistor designs, the overlap between the source and drain regions and the gate electrode leads to overlap capacitance, which reduces the switching speed of the transistor due to parasitic capacitance.

Innovation Solution

Embedding the bottom gate metal inside etch stop vias and positioning it in direct contact with a metal layer underneath prevents the source and drain regions from overlapping with the gate electrode, eliminating overlap capacitance and allowing the transistor to operate at a higher speed.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If the source and drain regions overlap with the gate electrode, then the transistor structure is simpler, but overlap capacitance increases causing circuit delay

Engineering Contradiction:
Improvetransistor structureVSAvoidcircuit delay
Core Design Contradiction:
Device complexityVSLoss of time

Solution Approach 1:

The patent introduces offset source and drain structures that are laterally displaced from the gate electrode in the planar dimension. This dimensional offset eliminates the vertical overlap between source/drain regions and gate electrode, thereby removing overlap capacitance while maintaining a relatively simple planar transistor structure.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Ease of manufacture

If the source and drain regions overlap with the gate electrode, then the manufacturing process is easier, but switching speed decreases due to parasitic capacitance

Engineering Contradiction:
Improvemanufacturing processVSAvoidswitching speed
Core Design Contradiction:
Ease of manufactureVSSpeed

Solution Approach 1:

The patent employs preliminary patterning steps where mandrels are formed first, followed by deposition of offset source and drain structures. This preliminary action establishes the lateral offset geometry before final electrode formation, enabling elimination of overlap capacitance while maintaining manufacturability through standard semiconductor fabrication processes.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS11929415B2Thin film transistors with offset source and drain structures and process for forming such
Publication Date: 2024.03.12 INTEL CORP
  • US11929415B2 patent drawing
  • US11929415B2 patent drawing
  • US11929415B2 patent drawing

AI summary

A device is disclosed. The device includes a source contact and a drain contact, a first dielectric between the source contact and the drain contact, a channel under the source contact and the drain contact, and a gate electrode below the channel, the gate electrode in an area under the first dielectric that does not laterally extend under the source contact or the drain contact. A second dielectric is above the gate electrode and underneath the channel.