Offset Via Contacts in Resin Insulators for Stress-Free Miniaturization
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Solution Overview
Problem
The miniaturization of electronic components is hindered by the stress-induced damage to conductors caused by the hardening of resin insulators, which leads to contraction stress and potential breakage during the manufacturing process.
Innovation Solution
The electronic component design includes an insulator with offset via conductive members in the stacking direction of the insulating layers, preventing direct stress concentration on the conductive contacts and ensuring stable connections, allowing for miniaturization while preventing conductor breakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If insulator and conductor are formed of layers using photolithography and plating technique, then coil component can be manufactured with precise dimensions, but contraction stress during insulator hardening may damage the conductor
Solution Approach 1:
The invention relocates the contact portion of the via conductive member from the bonding surface plane to a position offset in the stacking direction (vertical dimension). This dimensional shift removes the contact from the stress concentration zone where the insulator bonding surface exerts contraction stress during hardening, thereby preventing conductor damage while preserving manufacturing precision
Solution Approach 2:
The offset contact portion acts as an intermediary element that bridges the via conductive member to the upper conductive layer. By positioning this contact portion away from the bonding surface, it mediates the stress transmission between layers, allowing the insulator to harden without directly transmitting contraction stress to the conductor
2Volume of moving object
If conductor size is reduced for miniaturization, then component size decreases, but conductor becomes more susceptible to stress-induced damage
Solution Approach 1:
By moving the contact portion to an offset position in the stacking direction, the invention creates a geometric configuration where smaller conductors are protected from stress. The offset contact serves as a stress-relief geometry that allows miniaturization without proportionally reducing conductor strength, as the stress path is lengthened and redirected away from the vulnerable bonded interface
Data Source
AI summary
An electronic component according one embodiment of the disclosure includes an insulator, an internal conductor, and an external electrode. The insulator is made of a material containing resin. The insulator includes a first insulating layer that has a first bonding surface perpendicular to one axial direction and a second insulating layer bonded to the first bonding surface. The internal conductor includes a plurality of first via conductive members provided in the first insulating layer and a plurality of second via conductive members provided in the second insulating layer. Each of the first via conductive members has a first contact connected to the corresponding second via conductive member at a position offset in the one axial direction with respect to the first bonding surface.