Circuit Board Assembly With Offset Vias for Solder Reliability
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Solution Overview
Problem
Existing circuit board assemblies face challenges in meeting the overcurrent capability requirements for high-power charging due to deficiencies in soldering reliability, particularly with increased current densities, leading to issues like pseudo soldering and solder bridging.
Innovation Solution
A circuit board assembly design that includes M pads with first vias on N pads, and a second via positioned between adjacent pads with its center deviating from the connection line between these pads, along with traces connecting them, to enhance overcurrent capability and improve soldering reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If vias are provided between pads to improve overcurrent capability, then the overcurrent capability is improved, but soldering reliability deteriorates due to pseudo soldering and solder bridging
Solution Approach 1:
The patent applies asymmetry by intentionally positioning the second via off the connection line between pad centers. This asymmetric placement creates unequal distances from the via to adjacent pads, ensuring the via does not fall within the soldering influence zone of either pad, thereby preventing solder bridging while maintaining overcurrent capability
Solution Approach 2:
The patent transitions from a one-dimensional linear arrangement of vias along connection lines to a two-dimensional offset positioning. By moving the second via to a position between pads but offset from the connection line, the design utilizes spatial dimensionality to avoid soldering interference zones while preserving electrical connectivity
2Power
If vias are provided on pads to enhance overcurrent capability, then the current carrying capacity is improved, but pad integrity deteriorates due to occupation by traces and vias
Solution Approach 1:
The patent segments the via placement into two distinct groups: first vias positioned on pad centers for optimal electrical connection, and second vias positioned between pads for additional current paths. This segmentation allows each via type to serve its specific function without compromising pad integrity
Solution Approach 2:
The second via acts as an intermediary element positioned between adjacent pads. Instead of placing all vias directly on pads (which would compromise pad integrity), the second via serves as a mediator that provides current path while maintaining pad integrity by positioning itself in the space between pads
Data Source
AI summary
A circuit board assembly and a preparation method for a circuit board assembly are provided. The circuit board assembly includes a printed circuit board (101) and M pads, the M pads are provided at intervals on the printed circuit board (101), first vias (103) are provided on N pads (102) in the M pads, a second via (104) is further provided at a position between any two adjacent pads (102) in the N pads (102) on the printed circuit board (101), a center of the second via (104) deviates from a connection line between centers of the any two adjacent pads (102), both M and N are integers greater than 1, and N is less than or equal to M.