OGS Touch Screen Substrate Single Patterning Process
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Solution Overview
Problem
The conventional manufacturing process of OGS touch screen substrates is complex, leading to low yield due to the use of multiple patterning processes for forming transparent capacitance layers and conductive bridges using ITO thin films.
Innovation Solution
The use of nanoscale silver for the capacitance layer and conductive bridges, along with copper for electrical connection lines, allows for a single patterning process through different chemical properties, simplifying the manufacturing process and preventing corrosion of conductive bridges during etching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple patterning processes are used to form transparent capacitance layers and conductive bridges using ITO thin films, then the manufacturing precision can be maintained, but the device complexity increases and productivity decreases
Solution Approach 1:
The patent merges the formation of transparent capacitance layers and conductive bridges into a single patterning process by using the same ITO material for both structures. This eliminates the need for separate patterning processes, reducing device complexity while maintaining manufacturing precision through unified process control.
Solution Approach 2:
The ITO thin film serves multiple functions simultaneously - it forms both the transparent capacitance layers and the conductive bridges. This multi-functionality approach allows a single material and process to accomplish what previously required multiple specialized steps, thereby reducing overall process complexity.
2Manufacturing precision
If multiple patterning processes are used to form transparent capacitance layers and conductive bridges, then the manufacturing precision can be maintained, but the productivity decreases
Solution Approach 1:
By combining the formation of transparent capacitance layers and conductive bridges into one patterning process, the total processing time is reduced. This merging eliminates intermediate steps and allows both structures to be created simultaneously, directly improving productivity while preserving precision through unified process parameters.
Solution Approach 2:
The single patterning process enables continuous formation of both transparent capacitance layers and conductive bridges without interruption. This continuous action eliminates the start-stop nature of multiple sequential processes, maintaining consistent quality while accelerating production throughput.
3Reliability
If copper is used for electrical connection lines and nanoscale silver for conductive bridges, then the resistance is reduced, but the risk of corrosion increases
Solution Approach 1:
The patent introduces a barrier layer as an intermediary between the copper electrical connection lines and the nanoscale silver conductive bridges. This barrier layer prevents direct contact between the two metals, eliminating galvanic corrosion while allowing both materials to maintain their superior electrical conductivity properties.
Solution Approach 2:
The patent employs a composite structure consisting of copper, barrier layer, and nanoscale silver in a layered configuration. This composite material approach combines the low resistance of copper and silver with the protective properties of the barrier layer, achieving both electrical performance and corrosion resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves productivity and yield by simplifying the manufacturing process and reducing resistance, making it suitable for large-size touch-sensitive OGS panels.
Implementation Method 1
The use of nanoscale silver for the capacitance layer and conductive bridges, along with copper for electrical connection lines, allows for a single patterning process through different chemical properties
Data Source
AI summary
The present invention discloses a touch screen substrate and a method of manufacturing the same. The touch screen substrate includes a capacitance layer comprising a plurality of electrodes, a first cover layer formed on the capacitance layer; a plurality of conductive bridges located on the first cover layer and configured to be electrically connected to a part of the electrodes that are electrically isolated; and a plurality of electrical connection lines, configured to respectively be electrically connected to the respective conductive bridge so as to electrically connect the first electrode with a touch detecting circuit. A material layer for forming the electrical connection lines is different from a material layer for forming the conductive bridges such that the conductive bridges located below the electrical connection lines are not corroded when the material layer for the electrical connection lines is etched. Utilization of different chemical properties of copper and silver nanowires and ITO material and inclusion of a single patterning process increase productivity and yield.