OIS Unit Wire Spring Buffer Design
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Solution Overview
Problem
Camera modules in small-sized electronic devices face issues with hand-shaking prevention, requiring additional sensors which increase manufacturing costs and space requirements.
Innovation Solution
A camera module design incorporating a Printed Circuit Board (PCB) with image sensor, a housing unit, a holder module with coils, and wire springs connected through buffer units and adhesive substances to provide an optical image stabilizer function, minimizing the need for additional sensors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an additional angular velocity sensor is provided to implement hand-shaking prevention function, then hand-shaking prevention capability is improved, but manufacturing costs increase and additional installation space is required
Solution Approach 1:
The patent combines the hand-shaking prevention function with the existing camera module structure by integrating a movable platform that can shift the optical axis position. This eliminates the need for separate angular velocity sensors and their associated mounting structures, thereby reducing device complexity while maintaining hand-shaking prevention capability
Solution Approach 2:
The movable platform serves multiple functions: it acts as both the camera lens mounting structure and the hand-shaking correction mechanism. By making the platform movable in response to detection signals, the same structural element performs both structural support and active stabilization functions, avoiding additional components
2Ease of manufacture
If wire springs are connected directly to PCB without buffer units, then assembly is simpler, but connection reliability deteriorates due to stress concentration
Solution Approach 1:
The patent introduces buffer units at the connection points between wire springs and PCBs to preemptively absorb and distribute mechanical stress. These buffer units prevent stress concentration that would otherwise occur at direct connection points, thereby maintaining connection reliability without significantly complicating the assembly process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively stabilizes images against hand-shaking without the need for additional sensors, reducing manufacturing costs and space requirements while improving assembly reliability and image quality.
Implementation Method 1
a plurality of wire springs each configured to have one end connected to the second PCB and the other end connected to the third PCB
Implementation Method 2
an adhesive substance injected into the second wire spring through hole through the injection hole
Implementation Method 3
buffer units provided at the connection units of the wire springs and the third PCB and configured to surround the connection units of the wire springs and the third PCB
Implementation Method 4
a holder module spaced apart from a bottom surface within the housing unit at a specific interval and configured to have first coils wound on its outer circumferential face
Data Source
AI summary
An Optical Image Stabilization (OIS) unit including a base; a holder module comprising an outer blade spaced apart from the base, a bobbin disposed in the outer blade, and a spring member connecting the outer blade and the bobbin; a first coil disposed on the bobbin; a magnet configured to interact with the first coil; a second coil configured to interact with the magnet; a wire coupled with the holder module; a first connection unit fixing a first end portion of the wire; and a buffer portion disposed on a part of the wire and comprising an adhesive material. Further, in a direction perpendicular to the wire, a maximum width of the buffer portion is greater than a maximum width of the first connection unit.