OLED Anode ITO Layer Thickness for Etching Stability
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Solution Overview
Problem
The existing methods for manufacturing OLED display panels face issues where the photoresist is lost during the etching process, causing regions of the metal layer not to be etched to be exposed, leading to surface changes and quality deterioration of the OLED display.
Innovation Solution
The method involves forming an OLED display panel with an anode layer comprising a first Indium tin oxide (ITO) layer, a reflective silver metal layer, and a second ITO layer, where the second ITO layer has a greater film thickness than the first ITO layer, and all layers are etched together using a same process, ensuring the second ITO layer covers and protects the reflective layer even if the photoresist is lost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a three-layer lamination film is used with photoresist covering the top layer during etching, then the anode pattern can be formed, but the photoresist may be lost during etching causing the metal layer to be exposed and surface quality to deteriorate
Solution Approach 1:
The patent applies preliminary action by increasing the thickness of the top ITO layer before the etching process. This thicker top layer serves as a buffer that prevents the etching solution from reaching and exposing the metal layer when the photoresist is lost during etching, thereby maintaining metal layer surface quality while still allowing precise anode pattern formation.
Solution Approach 2:
The patent implements beforehand cushioning by designing a thicker top ITO layer that acts as a protective cushion over the metal layer. This cushioning layer compensates for the potential loss of photoresist during etching, ensuring that the metal layer remains protected and its surface quality is maintained throughout the manufacturing process.
2Loss of substance
If the top ITO layer is made thinner to reduce material usage, then manufacturing cost decreases, but the metal layer becomes vulnerable to exposure during etching
Solution Approach 1:
The patent applies preliminary action by pre-establishing a thicker top ITO layer that provides sufficient protection to the metal layer during etching. This approach ensures reliable metal layer protection while using a reasonable amount of ITO material, balancing material consumption with process reliability.
Solution Approach 2:
The patent applies parameter changes by optimizing the thickness parameter of the top ITO layer. By adjusting this parameter to be greater than the bottom ITO layer thickness, the patent achieves the right balance between protecting the metal layer during etching and controlling ITO material consumption.
Data Source
AI summary
A method for manufacturing an organic light emitting diode (OLED) display panel includes providing an array substrate; forming a first indium tin oxide (ITO) layer, a reflective layer, and a second ITO layer on the array substrate in order, wherein a film thickness of the second ITO layer is greater than a film thickness of the first ITO layer; forming a patterned photoresist on the second ITO layer; etching the second ITO layer, the reflective layer, and the first ITO layer by a same etching process to form a patterned anode layer; forming an OLED light emitting layer on the anode layer.