OLED Array Substrate Heat-Conducting Particle Doping

The patent introduces heat-conducting particles as an intermediary substance embedded within the non-conductive layer that directly contacts the OLED elements. These particles act as thermal mediators, facilitating heat transfer from the OLED elements through the non-conductive layer to the heat-conducting backplane, bypassing the thermal resistance of multiple layer structures.

The patent changes the thermal conductivity parameter of the non-conductive layer by incorporating heat-conducting particles with high thermal conductivity (such as alumina, aluminum nitride, or gallium phosphide). This parameter modification transforms the non-conductive layer from a thermal barrier into a heat-conducting pathway, enabling rapid heat dissipation while maintaining the layer's electrical insulation properties.

The patent applies local quality by differentiating the functional properties at different locations and scales. The heat-conducting particles provide high thermal conductivity at the local level where they are embedded, while the overall non-conductive layer maintains its electrical insulation property. This local optimization of thermal properties without compromising global electrical insulation resolves the contradiction.

The patent creates a composite material structure by combining heat-conducting particles (such as alumina, aluminum nitride, or gallium phosphide) with the non-conductive layer matrix. This composite structure leverages the high thermal conductivity of the particles while the surrounding non-conductive matrix maintains electrical insulation, achieving both heat conduction and electrical isolation simultaneously.