OLED Array Substrate Organic Filling Layer Drain Raising
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Solution Overview
Problem
Conventional OLED display panels have a low opening rate of the pixel defining layer due to the hole formed in the planarization layer for electrical interconnection, which reduces the lifespan of OLEDs by accelerating brightness attenuation.
Innovation Solution
An array substrate design featuring a flexible substrate with a buffer layer, active layer, gate insulating and metal layers, an organic filling layer, and a source-drain wiring layer, where the drain is raised by the organic filling layer to connect directly with the anode layer, eliminating the need for a hole in the planarization layer and increasing the opening rate of the pixel defining layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a hole is formed in the planarization layer for electrical interconnection, then the anode can be connected to the source-drain, but the opening rate of the pixel defining layer becomes smaller
Solution Approach 1:
The patent introduces a vertical protruding structure (organic filling layer with height) to achieve electrical connection in the vertical dimension, eliminating the need for a horizontal hole through the planarization layer. The drain electrode protrudes upward to contact the anode electrode directly, changing the connection path from planar to vertical.
Solution Approach 2:
The organic filling layer serves as an intermediary structure that provides both mechanical support and electrical connection pathway. It acts as a mediator between the drain electrode and anode electrode, enabling direct contact while maintaining the integrity of the planarization layer above.
2Duration of action of stationary object
If the opening rate of pixel defining layer is increased, then the lifespan of OLEDs is extended, but the electrical connection between anode and source-drain becomes more difficult
Solution Approach 1:
By transitioning from a planar connection (hole through planarization layer) to a vertical protruding connection, the patent enables increased opening rates while maintaining reliable electrical connection. The vertical dimension provides the connection pathway without requiring lateral space that would reduce the opening rate.
Solution Approach 2:
The organic filling layer is segmented into a protruding portion that specifically provides electrical connection, separating the connection function from the planarization function. This allows the planarization layer to be more extensive (higher opening rate) while the protruding portion handles the electrical connection task.
3Reliability
If a hole is formed in the planarization layer, then electrical interconnection is achieved, but the structure becomes more complex
Solution Approach 1:
The patent merges multiple functions into the organic filling layer: it provides mechanical filling, structural support, and electrical connection pathway simultaneously. The protruding portion of the organic filling layer combines the support function with the connection function, reducing overall structural complexity.
Solution Approach 2:
The electrical connection function is extracted from the planarization layer by creating a separate protruding structure. Instead of forming a hole through the planarization layer, the connection is achieved through the protruding organic filling layer and drain electrode, simplifying the planarization layer structure.
Data Source
AI summary
An array substrate and a method of manufacturing the same are provided. The array substrate sequentially includes a flexible substrate, a buffer layer, an active layer, a first gate insulating layer, a first gate metal layer, a second gate insulating layer, a second gate metal layer, an inter-insulating layer, a first organic filling layer, a source-drain wiring layer, a planarization layer, an anode layer, a pixel defining layer, and a supporting layer from bottom to top; the first organic filling layer is convex upward on the inter-insulating layer, making the source-drain wiring layer covering thereon disposed to be convex. The method of manufacturing the array, substrate is sequentially to manufacture the layers from bottom to top, wherein the convex first organic filling layer disposed on the inter-insulating layer of the array substrate is used to raise a drain thereon.