OLED Array Substrate Parallel Power Lines Voltage Drop

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

The existing OLED array substrates face issues with voltage drop due to high resistivity of aluminum electrodes and power lines, which affects display uniformity, and using copper or silver electrodes leads to oxidation and process instability.

Innovation Solution

The OLED array substrate employs a parallel connection of aluminum and low-resistivity copper or silver power lines through via holes, reducing voltage drop while maintaining the stability of aluminum electrodes and avoiding the immaturity of copper or silver processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If aluminum electrodes and power lines are used, then manufacturing stability is maintained, but voltage drop increases due to high resistivity

Engineering Contradiction:
Improvemanufacturing stabilityVSAvoidvoltage drop
Core Design Contradiction:
ReliabilityVSLoss of energy

Solution Approach 1:

The patent applies composite materials by creating a hybrid power line structure where aluminum power lines (providing manufacturing stability) are combined with copper or silver auxiliary power lines (providing low resistivity). These two different materials work together in the same circuit to simultaneously achieve manufacturing reliability and reduced voltage drop, directly resolving the technical contradiction between stability and energy loss.

Inventive Principle:
Principle #40Composite materials

2Loss of energy

If copper or silver electrodes are used, then voltage drop is reduced due to low resistivity, but oxidation occurs and process stability deteriorates

Engineering Contradiction:
Improvevoltage dropVSAvoidprocess stability
Core Design Contradiction:
Loss of energyVSReliability

Solution Approach 1:

The patent applies local quality by assigning different functional roles to different parts of the power line system. Copper or silver auxiliary power lines are used specifically in segments where low resistivity is critical for reducing voltage drop, while aluminum power lines are used in segments where manufacturing stability is paramount. This localized application of different material properties resolves the contradiction between reducing energy loss and maintaining process stability.

Inventive Principle:
Principle #3Local quality

3Loss of energy

If parallel connection of aluminum and copper/silver power lines is implemented, then voltage drop is reduced, but device complexity increases

Engineering Contradiction:
Improvevoltage dropVSAvoidpower line structure
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The patent applies merging by integrating the aluminum power line and copper/silver auxiliary power line into a unified parallel connection structure. The two different material lines are combined in parallel within the same circuit architecture, allowing them to work together synergistically to reduce voltage drop while sharing the same manufacturing and design framework, thus managing the complexity through unified integration rather than separate systems.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentEP3637469B1Organic light emitting diode array substrate and manufacturing method thereof, and display device
Publication Date: 2023.04.05 BOE TECHNOLOGY GROUP CO LTD
  • EP3637469B1 patent drawingFigure 1~2b
  • EP3637469B1 patent drawingFigure 3~4
  • EP3637469B1 patent drawingFigure 5~6

AI summary

An organic light-emitting diode array substrate and manufacturing method thereof, and display apparatus are provided. The organic light-emitting diode array substrate includes: a base substrate (201); a first metal layer (202) disposed on the base substrate (201); a first insulating layer (203) disposed on a side of the first metal layer (202) far away from the base substrate (201); a second metal layer (204) disposed on a side of the first insulating layer (203) far away from the base substrate (201); the first metal layer (202) includes a first power line (205), and the second metal layer (204) includes a second power line (206); the second power line (206) is connected in parallel with the first power line (205) through a first via hole (207) which penetrates the first insulating layer (203). The first power line and the second power line are connected in parallel through the via hole to reduce voltage drop.