OLED Array Substrate Bending Elimination via Through-Substrate Conductive Layers

The patent divides the conductive connection into multiple segments: a first conductive layer on the back surface of the substrate, a second conductive layer on the front surface, and passing layers penetrating through the substrate to electrically connect them. This segmentation eliminates the need for a single continuous bending region while maintaining electrical connectivity between the secondary functional region and the main display region.

The patent transitions from a planar two-dimensional connection to a three-dimensional structure by having conductive layers on both the front and back surfaces of the substrate, with passing layers extending through the thickness of the substrate. This dimensional change allows electrical connection without requiring the entire secondary functional region to be bent below the main display region.

By segmenting the conductive path into multiple layers and passing layers, the patent eliminates the need for a continuous bending region. The passing layers penetrate through the substrate to provide direct electrical connection points, removing the stress concentration points that would otherwise exist at bending locations and thereby preventing film breakage.

Instead of bending the secondary functional region below the main display region as in conventional designs, the patent inverts the approach by placing the first conductive layer on the back surface of the substrate and using passing layers to connect to the second conductive layer on the front surface. This inversion eliminates the bending requirement entirely, thereby eliminating the risk of film breakage at bending points.