OLED Avionics Thermal Isolation for Heat Management

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Solution Overview

Problem

OLED display packages experience luminance degradation over time, especially at elevated temperatures, due to heat generation from processing and graphics electronics, which accelerates the degradation of OLED subpixels.

Innovation Solution

An LED display package design incorporating a thermal isolation component between the LED heatsink and processing and graphics electronics, which separates the heat dissipation path for the LED display assembly from the heat generation path of the processing and graphics electronics, using a thermal insulating material or geometry to prevent direct thermal conduction and enhance cooling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If processing and graphics electronics are placed in close proximity to the LED display assembly, then device integration and compactness are improved, but heat generation from the electronics accelerates OLED luminance degradation

Engineering Contradiction:

Improvedevice compactnessVSAvoidOLED lifetime

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

The patent divides the thermal management system into separate segments: an LED heatsink dedicated to cooling the display assembly, and a processing electronics heatsink for cooling the electronics. This segmentation allows each component to be optimized independently for its specific thermal requirements while maintaining device compactness.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent introduces a thermal isolation component as an intermediary between the LED heatsink and the processing electronics heatsink. This intermediary prevents direct thermal conduction from the hot electronics to the temperature-sensitive OLED display, thereby protecting OLED lifetime while maintaining close proximity integration.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Device complexity

If a shared heatsink is used for both LED display assembly and processing electronics, then device complexity is reduced, but temperature control precision for the OLED deteriorates

Engineering Contradiction:

Improvethermal management structureVSAvoidOLED operating temperature

Core Design Contradiction:

Device complexityVSTemperature

Solution Approach 1:

The thermal management structure is segmented into separate heatsinks for the LED display assembly and processing electronics. This segmentation enables independent temperature control for each component, ensuring the OLED operates at optimal temperatures while simplifying the overall design compared to complex active cooling systems.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

A thermal isolation component serves as an intermediary between the two heatsink systems, blocking unwanted heat transfer from the electronics to the display. This maintains precise temperature control for the OLED while keeping the thermal management structure relatively simple.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Loss of energy

If thermal conduction path is maximized between processing electronics and heatsink, then cooling efficiency of electronics is improved, but heat transfer to LED display assembly increases accelerating OLED degradation

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidheat impact on OLED

Core Design Contradiction:

Loss of energyVSObject-affected harmful factors

Solution Approach 1:

The patent applies different thermal conduction qualities to different regions: high thermal conduction between the processing electronics and its dedicated heatsink for efficient cooling, and low thermal conduction (thermal isolation) between the LED heatsink and processing electronics to protect the OLED from harmful heat.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The thermal isolation component acts as a selective intermediary that allows efficient heat dissipation from the electronics to its heatsink while blocking heat transfer to the LED heatsink and subsequently to the OLED display assembly, thereby eliminating the harmful thermal effect.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This arrangement effectively reduces the operating temperature of the LED display package, slowing down the degradation of LEDs, including OLEDs and micro LEDs, by isolating the heat sources, thereby improving their efficiency and performance.

Implementation Method 1

The thermal isolation component is between the LED heatsink and the processing and graphics electronics arranged to thermally isolate the processing and graphics electronics from the LED heatsink

Methodology Applied

Scientific EffectThermal insulation: Thermal Insulation

Implementation Method 2

The LED heatsink thermally contacts the LED display assembly, and is disposed between the LED display assembly and the processing and graphics electronics

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

using a thermal insulating material or geometry to prevent direct thermal conduction and enhance cooling

Methodology Applied

Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentUS10278312B1Thermal management for extend OLED and micro LED avionics life

Publication Date: 2019.04.30 ROCKWELL COLLINS INC

AI summary

An LED display package includes an LED display assembly, processing and graphics electronics, an LED heatsink, and a thermal isolation component. The LED display assembly includes a plurality of LEDs. The processing and graphics electronics are configured to drive the LED display assembly. The LED heatsink thermally contacts the LED display assembly, and is disposed between the LED display assembly and the processing and graphics electronics. The thermal isolation component is between the LED heatsink and the processing and graphics electronics and is arranged to thermally isolate the processing and graphics electronics from the LED heatsink.