OLED Back Cover with Pocket Groove for PCB Protection

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Solution Overview

Problem

Existing OLED devices face increased production costs and time due to the need for additional components like cover shields, resulting in decreased production efficiency and limited space applicability, while also having a thicker and heavier profile due to complex rear surface designs.

Innovation Solution

The OLED device design eliminates the need for additional cover shields by adhering the printed circuit board directly to the rear surface of the back cover, using a connection member and a heat dissipation pad, and incorporates a simplified rear surface with a pocket groove and triple-layered back cover for effective heat dissipation, allowing for a thinner and lighter profile.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a cover shield is added to protect the printed circuit board, then the printed circuit board is protected from external impact, but the production cost increases and production time increases due to additional assembly steps

Engineering Contradiction:
Improveprotection of printed circuit boardVSAvoidproduction efficiency
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The back cover is designed with an integrated pocket groove structure that directly receives and protects the printed circuit board without requiring a separate cover shield. The pocket groove is formed as part of the back cover body, merging the protection function into the existing structure, thereby eliminating the need for additional components and assembly steps while maintaining protection reliability

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The cover shield component is completely removed from the design. Instead of adding a separate protective component, the back cover itself is modified to provide direct protection through the pocket groove structure, extracting the unnecessary intermediate component while preserving the protective function

Inventive Principle:
Principle #2Taking out (Extraction)

2Reliability

If a cover shield is added to protect the printed circuit board, then the printed circuit board is protected, but the thickness and weight of the OLED device increase

Engineering Contradiction:
Improveprotection of printed circuit boardVSAvoidweight of OLED device
Core Design Contradiction:
ReliabilityVSWeight of stationary object

Solution Approach 1:

The protective function is merged into the back cover structure itself through the pocket groove design. The back cover serves dual purposes: structural support and protection of the printed circuit board, eliminating the need for an additional cover shield that would increase weight

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The pocket groove structure provides protection using the thin-walled back cover itself rather than a thick, heavy cover shield. The design utilizes the existing back cover material to create a protective recess, achieving protection without adding significant weight or thickness

Inventive Principle:
Principle #30Flexible shells and thin films

3Stability of the object's composition

If the printed circuit board is adhered onto the rear surface of the back cover, then the structure is stable, but the available area of the rear surface is reduced and the shape becomes complicated

Engineering Contradiction:
Improvestructural stabilityVSAvoidavailable area of rear surface
Core Design Contradiction:
Stability of the object's compositionVSArea of stationary object

Solution Approach 1:

The printed circuit board is moved from being adhered to the flat rear surface to being received within a pocket groove that extends inward from the rear surface. This dimensional change allows the back cover to maintain a simple external shape with maximum rear surface area while providing stable protection through the recessed structure

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The back cover is segmented into different functional zones: the main body providing structural support and the pocket groove providing protection. This segmentation allows the rear surface to remain simple and maximize area while the pocket groove internally accommodates the printed circuit board for stability

Inventive Principle:
Principle #1Segmentation

4Reliability

If additional components like screws are used to assemble the cover shield, then the cover shield is securely coupled, but the production cost increases and assembly time increases

Engineering Contradiction:
Improvecoupling strength of cover shieldVSAvoidproduction cost and assembly simplicity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The coupling function is merged into the integral pocket groove structure of the back cover. The printed circuit board is retained by the pocket groove geometry itself rather than requiring separate fastening components, achieving secure coupling through the unified structure without additional screws or fasteners

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

All fastening components such as screws, clips, or adhesives are removed from the assembly process. The pocket groove structure provides inherent retention of the printed circuit board through its geometric design, eliminating the need for additional coupling components and simplifying manufacturing

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design reduces production costs and time, increases the available area on the rear surface, enhances space applicability and design flexibility, and achieves a lightweight and thin profile without electrical interference, improving overall efficiency and durability.

Implementation Method 1

a back cover (130) attached to the organic light emitting diode panel (110) by an adhesive layer

Methodology Applied
Scientific EffectAdhesion: Adhesive

Implementation Method 2

a heat radiator disposed between the driving circuit board and the organic light emitting diode panel, so as to redirect heat generated from the driving circuit board away from the organic light emitting diode panel

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP2947707B1Organic light emitting diode
Publication Date: 2019.04.03 LG DISPLAY CO LTD
  • EP2947707B1 patent drawingFigure 1
  • EP2947707B1 patent drawingFigure 2A~2B
  • EP2947707B1 patent drawingFigure 3

AI summary

An organic light emitting diode (OLED) according to an embodiment can include an OLED panel (110); a printed circuit board (118) adhered onto a rear surface of the OLED panel (110); and a back cover (130) including first and second metal layers (131a, 131b), an inorganic substance layer (131c) between the first and second metal layers (131a, 131b), and a pocket groove (135) in a horizontal surface on which the OLED panel (110) is placed and corresponding to the printed circuit board (118), wherein the pocket groove (135) is formed by removing the first metal layer (131a) corresponding thereto to expose the inorganic substance layer (131c).