OLED Backplane Composite Layer for Light Penetration and Heat Dissipation

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Solution Overview

Problem

Current OLED panels face issues with low light penetration, poor adhesion between the backplane and flexible substrate, inadequate heat dissipation, and mechanical weakness, leading to peeling and breakage during bending.

Innovation Solution

A composite material layer comprising boron nitride nanosheets and nanocellulose is introduced under the base layer, enhancing light transmittance, adhesion, thermal conductivity, and mechanical strength, formed using methods like spraying, spin coating, or inkjet printing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If a polymer backplane material is used, then the OLED device can be manufactured with flexible substrate compatibility, but the light penetration rate is poor (less than 60%) and cannot meet high light transmittance requirements

Engineering Contradiction:
Improvelight penetration rateVSAvoidadhesion between backplane and flexible substrate
Core Design Contradiction:
Illumination intensityVSReliability

Solution Approach 1:

The patent uses a composite material layer comprising boron nitride nanosheets and nanocellulose instead of traditional polymer backplane materials. This composite structure achieves high light transmittance (greater than 60%) while maintaining strong adhesion to the flexible substrate, resolving the contradiction between light penetration and adhesion reliability.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent changes the material parameters by introducing boron nitride nanosheets with specific dimensions (lateral size of 5-50 nm) and controlling their content (0.1-7 wt%) in the composite material. These parameter optimizations enable the material to simultaneously achieve high light transmittance and strong adhesion properties.

Inventive Principle:
Principle #35Parameter changes

2Temperature

If a polymer backplane material is used, then the device structure can be simplified, but the thermal conductivity is poor (0.1 to 0.2 W/mK) and cannot dissipate heat generated by circuits

Engineering Contradiction:
Improveheat dissipation capabilityVSAvoidmechanical strength at bending area
Core Design Contradiction:
TemperatureVSStrength

Solution Approach 1:

The patent employs a composite material layer with boron nitride nanosheets (thermal conductivity of 20-50 W/mK) dispersed in nanocellulose matrix. This composite structure achieves high thermal conductivity for effective heat dissipation while maintaining mechanical strength, particularly at bending areas where traditional polymer materials fail.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent introduces boron nitride nanosheets specifically in the composite material layer to provide localized high thermal conductivity pathways. The nanosheets are distributed throughout the layer to create efficient heat dissipation channels without compromising the overall mechanical integrity of the backplane structure.

Inventive Principle:
Principle #3Local quality

3Ease of manufacture

If traditional backplane materials are used, then the manufacturing process is simple, but the adhesion between backplane and flexible substrate is poor causing panels to peel off

Engineering Contradiction:
Improvemanufacturing process simplicityVSAvoidadhesion strength
Core Design Contradiction:
Ease of manufactureVSStrength

Solution Approach 1:

The patent uses a composite material layer comprising nanocellulose and boron nitride nanosheets that provides strong adhesion to the flexible substrate. The nanocellulose component creates effective bonding interfaces while the overall composite structure maintains manufacturing feasibility through established coating techniques.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The composite material layer acts as an intermediary between the flexible substrate and the OLED structure. The nanocellulose component specifically provides bonding functionality that mediates the interface between the flexible substrate and the rigid OLED components, preventing peeling while maintaining manufacturing simplicity.

Inventive Principle:
Principle #24Intermediary (Mediator)

4Strength

If traditional backplane materials are used, then the device structure is conventional, but the mechanical strength is low causing breakage at bending areas when bonded with glass cover

Engineering Contradiction:
Improvemechanical strengthVSAvoidlight transmittance
Core Design Contradiction:
StrengthVSIllumination intensity

Solution Approach 1:

The patent employs a composite material layer with boron nitride nanosheets dispersed in nanocellulose matrix. This composite structure achieves high mechanical strength (tensile strength greater than 100 MPa) to prevent breakage at bending areas while maintaining high light transmittance (greater than 60%) for under-screen camera compatibility.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent optimizes the parameters by controlling the boron nitride nanosheet content (0.1-7 wt%) and lateral size (5-50 nm) in the composite material. These parameter optimizations enable the material to simultaneously achieve high mechanical strength for breakage prevention and high light transmittance for display performance.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution significantly improves light transmittance, prevents peeling, ensures effective heat dissipation, and maintains mechanical integrity during bending, addressing the limitations of traditional backplane materials.

Implementation Method 1

The backplane 12 is a polymer material, and its thermal conductivity is poor, and the thermal conductivity is about 0.1 to 0.2 W/mK. It is impossible to dissipate heat generated by circuits under the OLED devices while operating

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The commonly used backplane 12 has poor light penetration (average penetration rate is less than 60%) and cannot meet high light transmittance requirements for OLED devices of future under-screen cameras

Methodology Applied
Scientific EffectLight transmission: Light

Data Source

PatentUS11793056B2OLED device structure and manufacturing method thereof
Publication Date: 2023.10.17 WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO LTD
  • US11793056B2 patent drawing
  • US11793056B2 patent drawing
  • US11793056B2 patent drawing

AI summary

An organic light emitting diode (OLED) device structure and a manufacturing method thereof are provided. The OLED device structure includes a base layer, an array segment film layer, an organic light emitting layer, a thin film packing layer, a touch layer, a polarizer, a cover glass, a composite material layer, and a foam copper foil layer. The OLED device structure can solve problems of low penetration rate, poor heat dissipation, buffer layers are easy to peel, and easy breakage in backplane layers of current OLED panels.