OLED Backplane Perforation Encapsulation via Segmented Barriers
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Solution Overview
Problem
In OLED display devices, the lack of encapsulation in the perforation region leads to bubble inclusion during film formation, causing film rupture when temperature rises, and allows water and oxygen invasion, compromising the display backplane's integrity.
Innovation Solution
A method for manufacturing a display backplane that includes forming a planarization layer within the pixel, partition, and perforation regions, followed by the creation of annular passivation layers and isolation columns to prevent bubble inclusion and ensure effective encapsulation, preventing film rupture and external moisture ingress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If the perforation region is left without encapsulation to achieve higher screen-to-body ratio, then the visual appearance and screen-to-body ratio are improved, but bubbles are included during film formation and water/oxygen invasion occurs causing film rupture
Solution Approach 1:
The encapsulation structure is segmented into different regions: the pixel region receives full encapsulation while the perforation region maintains an open structure. The partition region acts as a transition zone with partial encapsulation, separating the encapsulated pixel regions from the non-encapsulated perforation region, thus allowing the perforation region to remain open for high screen-to-body ratio while preventing bubble and moisture invasion through the partition barriers
Solution Approach 2:
Different encapsulation qualities are applied to different regions of the display backplane. The pixel region receives complete encapsulation with planarization layer and passivation layers for protection, while the perforation region maintains an open structure without encapsulation for visual appeal. The partition region provides localized encapsulation barriers at its boundaries to prevent harmful factor invasion into the pixel regions
2Reliability
If encapsulation structures are added to the perforation region to prevent bubble inclusion and water/oxygen invasion, then film integrity and reliability are improved, but the screen-to-body ratio and visual appearance deteriorate
Solution Approach 1:
The display backplane is divided into distinct functional regions with different encapsulation requirements. The pixel region is fully encapsulated for protection, while the perforation region is left open to maintain high screen-to-body ratio. The partition region serves as a boundary zone that provides encapsulation barriers without extending into the perforation region, thus protecting the pixel regions while preserving the open appearance of the perforation region
3Object-affected harmful factors
If the partition region is fully encapsulated to prevent water and oxygen invasion, then the reliability and protection against external factors are improved, but the manufacturing complexity and process difficulty increase
Solution Approach 1:
The planarization layer is formed first to provide a flat surface and initial barrier across the entire substrate including the partition region. Subsequently, annular passivation layers are deposited specifically in the partition region to create targeted encapsulation barriers at the boundaries. This sequential approach with preliminary planarization simplifies the overall manufacturing process by establishing a foundation layer before adding region-specific protective structures
Data Source
AI summary
A method for manufacturing a display backplane, a display backplate, and a display device are disclosed. The method includes: forming a planarization layer on one side of a substrate inside a pixel region, a partition region, and a perforation region; forming at least one girdle of annular passivation layer disposed around the perforation region on a surface, away from the substrate, of the planarization layer inside a portion of the partition layer; removing a portion of the planarization layer, inside the partition region, uncovered by the annular passivation layer and the planarization layer, inside the partition region, partially covered by the annular passivation layer, to obtain at least one girdle of annular isolation columns disposed between the substrate and the annular passivation layer and around the perforation region; and forming organic light-emitting elements on one side of the planarization layer away from the substrate to obtain the display backplane.