OLED Packaging Barrier Layer for Laser Sintering
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Solution Overview
Problem
Existing OLED device packaging methods using laser irradiation to sinter glass adhesives can cause thermal damage to the cathode layer and neighboring organic light emitting layers due to the risk of laser spots falling on these sensitive areas, especially in narrow frame designs.
Innovation Solution
A packaging method that includes forming a barrier layer on the packaging cover plate to block the laser from irradiating the OLED array substrate, using materials like aluminum and copper with alternating layers to absorb and reflect the laser, thereby preventing thermal damage and allowing for a narrow frame design without replacing equipment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If laser irradiation is used to sinter the glass adhesive, then the packaging cover plate and array substrate are adhered together, but the laser may irradiate the cathode layer and cause thermal damage to film layers and organic light emitting layers
Solution Approach 1:
A metal barrier layer is introduced as an intermediary between the laser and the OLED device. This barrier layer absorbs and reflects laser energy, preventing direct irradiation of the cathode layer and organic light emitting layers while allowing the glass adhesive to be properly sintered for strong adhesion between the packaging cover plate and array substrate.
Solution Approach 2:
The metal barrier layer converts the harmful laser energy into beneficial thermal energy for sintering the glass adhesive. By positioning the barrier layer to face the laser source, it absorbs laser energy and converts it to heat, which facilitates the sintering process while simultaneously protecting the underlying OLED components from direct laser damage.
2Length of moving object
If the distance between the glass adhesive and cathode layer is reduced for narrow frame design, then the frame width is reduced, but the possibility of laser spot falling on the cathode layer increases
Solution Approach 1:
The metal barrier layer serves as a protective intermediary that enables narrow frame design by decoupling the distance between glass adhesive and cathode layer from the laser protection function. The barrier layer extends over the cathode layer area, providing reliable protection even when the frame is narrowed, thus maintaining light emission reliability while achieving compact design.
3Reliability
If a barrier layer is added to block the laser, then thermal damage to OLED device is prevented, but the device complexity increases
Solution Approach 1:
The barrier layer is implemented as a thin film structure deposited on the packaging cover plate, minimizing the increase in device complexity. This thin film approach provides effective laser protection while maintaining a simple packaging structure that integrates seamlessly with the existing OLED device architecture.
Solution Approach 2:
The packaging structure is enhanced by adding a metal barrier layer with specific optical properties (high laser absorption and reflection) to the packaging cover plate. This composite structure combines the protective function of the metal layer with the structural function of the packaging cover plate, achieving reliable laser protection without significantly complicating the overall device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The barrier layer effectively blocks the laser, preventing thermal damage to the OLED device and enabling a narrow frame design without increasing costs by maintaining existing laser equipment, thus enhancing the reliability and design flexibility of OLED packaging.
Implementation Method 1
using materials like aluminum and copper with alternating layers to absorb and reflect the laser
Implementation Method 2
using materials like aluminum and copper with alternating layers to absorb and reflect the laser
Implementation Method 3
applying, from a side of the packaging cover plate facing away from the OLED array substrate, a laser to the glass adhesive, to sinter the glass adhesive
Data Source
AI summary
The present disclosure provides a packaging method, a display panel, and a display device. The packaging method includes forming a glass adhesive on a packaging area of an OLED array substrate or on a packaging cover plate, aligning the packaging cover plate with the OLED array substrate, and applying, from a side of the packaging cover plate facing away from the OLED array substrate a laser to the glass adhesive, to sinter the glass adhesive, wherein the packaging method further includes forming a barrier layer on the packaging cover plate, the barrier layer being configured to block the laser from irradiating an OLED device on the OLED array substrate when the laser irradiates the glass adhesive.