OLED Barrier Rib and Encapsulation Layout for Maskless Sensor Integration
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Solution Overview
Problem
Existing electronic devices face challenges in manufacturing light emitting elements without using metal masks, which affect process reliability and product size, particularly in the integration of input sensors and encapsulation layers.
Innovation Solution
The electronic device is manufactured with a barrier rib structure that includes a first portion and a second portion separated by a distance less than or equal to the thickness of an encapsulation layer, allowing for improved process reliability and reduced product size, and incorporates a sensor electrode design with conductive layers on different layers for enhanced input detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a metal mask is used to manufacture light emitting elements, then manufacturing precision is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent removes the metal mask from the manufacturing process entirely. Instead of using a metal mask to define the light emitting opening, the invention uses a barrier rib structure with a through-hole that is formed through photolithography and etching processes only, eliminating the need for metal mask fabrication and transfer steps.
Solution Approach 2:
The patent replaces the mechanical metal mask system with a purely photolithography and etching-based process. The barrier rib structure serves as both the mechanical barrier and the pattern definition, eliminating the need for separate metal mask components and their associated handling and alignment mechanisms.
2Reliability
If the barrier rib structure is modified to improve process reliability, then manufacturing reliability is improved, but device complexity increases
Solution Approach 1:
The barrier rib is divided into multiple segments: a first barrier rib portion with a first through-hole for the light emitting element, and a second barrier rib portion with a second through-hole for the sensor electrode. This segmentation allows each portion to be optimized independently for its specific function while maintaining overall process reliability.
Solution Approach 2:
The patent introduces a vertical dimension to the barrier rib structure by forming undercut portions that extend downward from the main barrier rib body. This vertical extension creates additional space for the light emitting element and sensor electrode without increasing the horizontal footprint, effectively using the z-dimension to resolve spatial constraints.
3Volume of moving object
If the distance between barrier rib portions is reduced to downsize the device, then product size is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent merges the barrier rib structure with the pixel defining film structure. The pixel defining film is formed continuously over the barrier rib, and the light emitting opening is formed through both structures in a single etching process. This merging eliminates the need for separate alignment steps between the barrier rib and pixel defining film, reducing the cumulative precision requirements.
Solution Approach 2:
The barrier rib structure is formed first with the through-holes defined by photolithography patterns. The pixel defining film is then formed over the barrier rib, and the light emitting opening is formed through both structures. This preliminary formation of the barrier rib with pre-defined through-holes establishes the alignment reference before subsequent layers are added, ensuring precise positioning without requiring tight tolerances in later steps.
4Adaptability or versatility
If encapsulation layers are integrated with sensor structures, then device functionality is improved, but manufacturing process complexity increases
Solution Approach 1:
The barrier rib structure serves multiple functions simultaneously: it acts as a barrier to prevent material diffusion, provides structural support for the light emitting element, creates openings for electrical connections, and serves as an alignment reference for the sensor electrode. This multi-functionality reduces the need for separate structural components and simplifies the overall manufacturing process.
Solution Approach 2:
The patent embeds the sensor electrode structure within the encapsulation layers. The first conductive layer is disposed between the second and third encapsulation layers, with the second conductive layer on top of the third encapsulation layer. This nested arrangement allows the sensor to be integrated into the stacked structure without requiring additional horizontal space or separate manufacturing steps for sensor formation.
Data Source
AI summary
An electronic device is disclosed that includes a base layer, a pixel defining film disposed on the base layer and having a light emitting opening defined therein, a barrier rib disposed on the pixel defining film, having conductivity, and including a first portion having a first barrier rib opening corresponding to the light emitting opening and a second portion insulated from the first portion, a light emitting element disposed in the light emitting opening and including an anode, an intermediate layer disposed on the anode, and a cathode disposed on the intermediate layer and connected to the first portion, a first encapsulation layer covering the cathode, a second encapsulation layer covering the light emitting opening and the first barrier rib opening, a third encapsulation layer disposed on the second encapsulation layer, and a sensor disposed on the light emitting element and including a first sensor electrode and a second sensor electrode, wherein the sensor includes a first conductive layer disposed between the second encapsulation layer and the third encapsulation layer and a second conductive layer disposed on the third encapsulation layer, and the first conductive layer is electrically connected to the second portion through the first encapsulation layer.