OLED Barrier-Wall Structure for Maskless Thin-Film Deposition

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Solution Overview

Problem

The formation accuracy of thin films in display devices with organic light-emitting diodes (OLEDs) is deteriorated due to processing inaccuracies of fine masks and deformation of opening shapes, leading to reliability issues.

Innovation Solution

A manufacturing method involving a barrier wall structure with multiple layers, including a first metal layer, a second insulating layer, and a protective layer, is used to form openings in the insulating layer, which serves as a mask for precise deposition of the organic layer and upper electrode without requiring a fine mask, thereby enhancing accuracy and reducing manufacturing costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a fine mask including openings corresponding to respective pixels is applied for deposition, then the organic layer and second electrode can be formed, but the formation accuracy of the thin film is deteriorated due to processing accuracy of the fine mask and deformation of the opening shape

Engineering Contradiction:

Improveformation accuracy of thin filmVSAvoidprocessing complexity of fine mask

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The invention extracts and eliminates the fine mask from the deposition process. Instead of using a fine mask with openings corresponding to pixels, the patent forms the organic layer and second electrode through a maskless deposition process, thereby removing the source of processing inaccuracies and opening shape deformations while maintaining the required patterning precision through alternative means

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The invention introduces an intermediary layer structure between the substrate and the deposition target area. This intermediary structure serves as a physical barrier or guide that enables precise thin film formation without requiring a fine mask, thus mediating between the deposition process and the final pixel pattern while improving formation accuracy

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If a fine mask is used for deposition, then the organic layer can be formed, but manufacturing costs increase and reliability decreases due to mask deformation and processing inaccuracies

Engineering Contradiction:

Improvereliability of thin film formationVSAvoidmanufacturing cost and complexity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The invention removes the fine mask from the manufacturing process entirely, eliminating the associated costs of mask fabrication, alignment, and replacement. This extraction of the mask component simplifies the manufacturing process and improves reliability by removing the variable of mask deformation and processing inaccuracies

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The invention enables the deposition process to be self-guiding or self-patterned through the use of pre-formed structural layers that naturally define the deposition areas. This self-service mechanism eliminates the need for external mask guidance, reducing manufacturing complexity and improving consistency across production batches

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method improves the formation accuracy of the organic layer and upper electrode, reducing manufacturing costs and enhancing the reliability of the electronic device by minimizing exposure to etchants and maintaining precise shape during deposition processes.

Implementation Method 1

Methodology Applied

Scientific EffectPhysical mask:

Implementation Method 2

For example, the organic layer is formed by vacuum deposition and the second electrode is formed by sputtering

Methodology Applied

Scientific EffectVacuum deposition: Physical Vapour Deposition

Implementation Method 3

For example, the organic layer is formed by vacuum deposition and the second electrode is formed by sputtering

Methodology Applied

Scientific EffectSputtering: Sputtering

Implementation Method 4

The opening is formed by dry etching the second insulating layer using the barrier wall as a mask

Methodology Applied

Scientific EffectEtching:

Data Source

PatentUS12419173B2Electronic device and manufacturing method of the same

Publication Date: 2025.09.16 MAGNOLIA WHITE CORP

AI summary

According to one embodiment, an electronic device includes a lower electrode, a second insulating layer including an opening overlapping the lower electrode, an organic layer covering the lower electrode at the opening, an upper electrode covering the organic layer, and a barrier wall on the second insulating layer. The barrier wall includes a first layer formed of a metal material and including a first side surface which is in contact with the upper electrode, a second layer disposed above the first layer and extending from the first side surface toward the opening, and a protective layer formed of a material different from a material of the organic layer and covering at least an upper surface of the second layer.