OLED Bendable Connection Area Wire Stress Relief
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Solution Overview
Problem
Bendable connection areas between display and non-display areas in OLED panels are prone to breakage due to stress, leading to increased impedance and short circuits when wires are bent at large angles.
Innovation Solution
A display panel design featuring an inorganic insulating layer with recesses filled with an organic filling layer and a wiring layer, forming concave curved surfaces to increase wire length and flexibility, along with an organic protective layer to reduce stress and breakage risks, and a method involving substrate preparation, recess formation, filling, and wiring layer deposition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the connection area is bent at a large angle to achieve narrow bezels, then the distance between the main display area and borders is shortened, but the wiring layer and other layer components are subjected to stresses and are liable to be broken
Solution Approach 1:
The patent introduces a buffer layer with a convex curved surface in the bendable connection area, and the wiring layer conforms to this curved surface. The curved structure allows the wiring layer to bend more easily and reduces stress concentration during large-angle bending, thereby preventing wire breakage while enabling narrow bezels.
Solution Approach 2:
The patent changes the physical parameters of the buffer layer by selecting materials with specific properties (organic material with appropriate elasticity and thickness of 1-10 micrometers). This material parameter selection enables the buffer layer to effectively absorb bending stresses and protect the wiring layer from breakage.
2Area of stationary object
If the connection area is bent at a large angle, then narrow bezels are achieved, but various layer components are subjected to stresses resulting in increased impedance or short circuiting
Solution Approach 1:
The convex curved surface of the buffer layer creates a gradual bending transition for the wiring layer, preventing sharp folds and stress concentrations that would cause impedance increases or short circuits. The curved geometry distributes mechanical stress evenly across the bending area.
Solution Approach 2:
The buffer layer acts as an intermediary between the substrate and the wiring layer. It absorbs and dissipates bending stresses before they reach the wiring layer, thereby preventing harmful effects such as impedance increases and short circuiting that would otherwise occur during large-angle bending.
3Reliability
If a buffer layer with a convex curved surface is introduced to improve wire bendability, then stress on wires is reduced, but the device complexity increases
Solution Approach 1:
The buffer layer is formed using existing organic insulating layer materials and standard thin-film deposition techniques. By controlling the thickness parameter (1-10 micrometers) and forming a simple convex curved surface, the patent achieves stress reduction without significantly increasing manufacturing complexity.
Solution Approach 2:
The buffer layer serves multiple functions simultaneously: it provides mechanical stress relief, acts as an insulating layer, and serves as a structural support. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity while achieving improved wire bendability.
Data Source
AI summary
A display panel and a manufacturing method thereof are provided. The display panel has a display area, a non-display area, and a bendable connection area being located between the display area and the non-display area and connecting the display area with the non-display area. The display panel includes a substrate; an inorganic insulating layer disposed on the substrate, wherein in the bendable connection area, a plurality of recesses are defined in the inorganic insulating layer; an organic filling layer filled in the plurality of recesses in the inorganic insulating layer and having a concave curved surface; and a wiring layer disposed on the inorganic insulating layer, wherein a concave curved surface formed on the wiring layer corresponds to the concave curved surface of the organic filling layer in each of the recesses.