Flexible OLED Bending Region Layout With Reduced Mask Processing
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Solution Overview
Problem
The manufacturing cost of flexible OLED devices is increased due to the need for multiple mask processes to remove inorganic insulation layers in the bending section, compromising the bendability and flexibility.
Innovation Solution
A substrate with a buffer layer and insulation layer structure that includes openings to expose the substrate in the bending region, along with fan-out wiring and connection electrodes, allowing for a flexible OLED device design that reduces the need for mask processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple mask processes are used to remove inorganic insulation layers in the bending section, then the bendability is improved, but the manufacturing cost increases
Solution Approach 1:
The patent extracts the inorganic insulation layers from the bending section through selective removal processes, taking out only the necessary portions that hinder bending while preserving the overall structure. This extraction approach improves bendability without requiring multiple complex mask processes throughout the entire device structure.
Solution Approach 2:
The device is segmented into different functional regions: a bending section where inorganic insulation layers are removed to enable flexibility, and a non-bending section where the layers remain for protection. This segmentation allows the device to have both flexible and protected areas, resolving the contradiction between bendability and manufacturing complexity.
2Adaptability or versatility
If multiple mask processes are used to remove inorganic insulation layers, then the flexibility is improved, but the device complexity increases
Solution Approach 1:
The patent applies extraction by removing inorganic insulation layers only from the specific bending section rather than throughout the entire device. This targeted removal reduces the number of mask processes needed compared to comprehensive removal, improving flexibility while minimizing added complexity.
Solution Approach 2:
Different regions of the device have different structural qualities: the bending section has removed inorganic layers for flexibility, while other sections maintain the full layered structure for protection and functionality. This local differentiation optimizes flexibility where needed without unnecessarily increasing overall device complexity.
3Adaptability or versatility
If inorganic insulation layers are removed in the bending section, then the bendability is improved, but the protection against moisture and impurities is reduced
Solution Approach 1:
The device structure is segmented into a bending section with removed inorganic layers for flexibility and protected sections with intact layers for moisture and impurity barrier. This segmentation allows the device to achieve both bendability and protection by assigning different functional roles to different regions.
Solution Approach 2:
The patent employs flexible substrate materials and thin film structures that can bend while providing protection. The flexible substrate compensates for the removed inorganic insulation layers in the bending section, maintaining both flexibility and a degree of environmental protection.
Data Source
AI summary
An OLED device includes a substrate having a display region including a pixel region and first and second peripheral regions surrounding the pixel region. A bending region is between the display region and the second peripheral region. A buffer layer has a first opening exposing an upper surface of the substrate. A plurality of pixel structures is disposed in the pixel region on the buffer layer. An insulation layer structure is disposed on the buffer layer. The insulation layer structure has a second opening exposing an upper surface of the substrate that is disposed in the bending region and a first portion of the buffer layer that is disposed adjacent to the bending region. A fan-out wiring is disposed between two adjacent insulation layers of the plurality of insulation layers. The fan-out wiring is disposed in the first peripheral region and/or the second peripheral region.