OLED Display Bending Radius Reduction via Segmented Support Layers
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Solution Overview
Problem
The presence of a multi-layer support layer in OLED display devices increases the bending radius of the bending part, resulting in a larger border at the corresponding location.
Innovation Solution
A display device configuration that includes a display panel body with a flat plate part, a bending part, and a solder pad part, along with a backplate layer, a rigid support layer, a buffer layer, a notch, an adhesive layer, and a heat dissipation support layer, which reduces the thickness of the multi-layer support layer and minimizes the bending radius.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a multi-layer support layer is designed on the back side of the flat plate part, then the display device achieves excellent performances with proper support and structural stability, but the bending radius of the bending part increases, resulting in a larger border
Solution Approach 1:
The support layer is divided into multiple independent layers: a first support layer (330) and a second support layer (340), with the buffer layer (320) positioned between them. This segmentation allows each layer to perform its specific function independently, reducing the overall bending radius while maintaining structural stability.
Solution Approach 2:
Different regions of the support structure have different properties: the buffer layer (320) provides flexibility and shock absorption in the bending region, while the first support layer (330) and second support layer (340) provide rigid support in their respective regions. This local differentiation optimizes both bending performance and structural stability.
2Reliability
If a multi-layer support layer is designed on the back side of the flat plate part, then proper support and structural stability are achieved, but the border size at the bending part location becomes larger
Solution Approach 1:
The support layer is segmented into multiple thin layers (first support layer 330, buffer layer 320, second support layer 340) rather than one thick layer. This segmentation reduces the total thickness of the support structure, thereby reducing the border size while maintaining the necessary support function through the coordinated action of multiple layers.
Solution Approach 2:
The buffer layer (320) acts as a flexible thin film that provides necessary support and shock absorption without adding significant thickness. This allows the border size to be minimized while still achieving proper structural support.
3Reliability
If the buffer layer thickness is increased to improve buffering performance, then shock absorption and impact resistance are enhanced, but the bending radius increases and border size becomes larger
Solution Approach 1:
The buffering function is segmented and distributed across multiple layers (buffer layer 320, first support layer 330, second support layer 340) rather than concentrated in a single thick buffer layer. This allows adequate buffering performance to be achieved with thinner individual layers, reducing the overall bending radius and border size.
Solution Approach 2:
The support structure uses a composite multi-layer configuration combining buffer material (320) with support materials (330, 340). This composite structure achieves both buffering and support functions with optimized thickness, preventing excessive bending radius while maintaining reliability.
Data Source
AI summary
The present disclosure discloses a display device and a display terminal. A first backplate is disposed on a back side of a flat plate part; a second backplate is disposed on a side of a solder pad part; a rigid support layer is attached onto the first backplate; a buffer layer is attached onto the rigid support layer; a notch is provided at an end of the buffer layer close to a bending part; an adhesive layer is disposed at the end of the buffer layer close to the bending part, and the second backplate is attached onto a surface of the notch through the adhesive layer; and a heat dissipation support layer is disposed on a side of the buffer layer.