OLED Bezel Cutting Portion for Corrosion Resistance

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Solution Overview

Problem

Organic light emitting diode (OLED) display panels experience electrochemical corrosion of lead wire ends during reliability tests, leading to signal line short-circuits and vertical bright and dark line defects due to high-temperature and high-humidity conditions.

Innovation Solution

A display panel design featuring a substrate with lead wires and bonding pads in the bezel area, where cutting portions made of materials with higher corrosion resistance than the lead wires are formed in the same layer as the bonding pads, reducing electrochemical corrosion without adding new processes. These cutting portions are connected to the lead wires and located away from the display area, with a planarization layer covering part of the cutting portion to expose it minimally.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If lead wires are used in the bezel area during reliability tests, then electrical connection is achieved, but electrochemical corrosion occurs under high-temperature and high-humidity conditions leading to short-circuits and defects

Engineering Contradiction:
ImprovereliabilityVSAvoidelectrochemical corrosion
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent introduces a cutting portion as an intermediary component between the lead wire and the display area. This cutting portion is formed by the same material layer as the bonding pad (typically a corrosion-resistant metal layer) and serves as a protective barrier that prevents direct exposure of the lead wire to corrosive environments during reliability tests, thereby eliminating electrochemical corrosion while maintaining electrical connection.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If cutting portions made of corrosion-resistant material are formed in the same layer as bonding pads, then electrochemical corrosion is reduced, but manufacturing process complexity increases

Engineering Contradiction:
Improveelectrochemical corrosionVSAvoidmanufacturing process complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent merges the formation of the cutting portion with the existing bonding pad material layer deposition process. Both the bonding pad and the cutting portion are formed from the same material layer (a corrosion-resistant metal layer) in the same manufacturing step, eliminating the need for additional separate processes. This integration approach reduces manufacturing complexity while achieving corrosion protection.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces electrochemical corrosion of the cutting portions, preventing short-circuits and defects in OLED display panels without increasing manufacturing complexity or processes.

Implementation Method 1

ends of lead wires in a terminal area are electrochemically corroded in a section of a cutting line, so that signal lines are short-circuited to each other

Methodology Applied
Scientific EffectElectrochemical corrosion: Crevice Corrosion

Data Source

PatentUS20230097113A1Display panel and manufacturing method thereof
Publication Date: 2023.03.30 SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
  • US20230097113A1 patent drawing
  • US20230097113A1 patent drawing
  • US20230097113A1 patent drawing

AI summary

A display panel and a manufacturing method thereof are provided. The display panel includes a substrate, and a first lead wire, a first bonding pad, and a first cutting portion located in a bezel area of the substrate. The first bonding pad is arranged on a side of the first lead wire away from the substrate. The first bonding pad is arranged corresponding to the first lead wire and connected with the first lead wire. The first cutting portion is arranged in a same layer as the first bonding pad, spaced apart from the first bonding pad, and formed of same material as the first bonding pad. The first cutting portion is located on a side of the first lead wire away from the display area and connected with the first lead wire.