Transparent OLED Bezel Reduction via Substrate Power Lines
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Solution Overview
Problem
Existing transparent OLED devices face challenges in reducing the width and thickness of their bezels due to the need for additional interconnection films to connect circuit boards, which increases the bezel size and thickness, and complicates the formation of multi-layered interconnection lines during the manufacturing process.
Innovation Solution
The solution involves forming power lines and connecting lines directly on the substrate of the transparent OLED device, eliminating the need for an additional interconnection film by connecting elements on one side of the device to elements on the other side via lines formed on the substrate, thereby reducing the bezel width and thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an additional interconnection film is used to connect circuit boards, then electrical connection between elements on separate circuit boards is achieved, but the bezel width and thickness of the transparent display device are increased
Solution Approach 1:
The patent merges the interconnection function with the existing substrate by forming conductive lines directly on the transparent substrate. This combines the substrate's structural role with the interconnection function, eliminating the need for a separate interconnection film and thereby reducing the bezel width while maintaining electrical connectivity between circuit boards.
Solution Approach 2:
The transparent substrate is given multiple functions: it serves as both the structural support for the display and as the interconnection medium. By forming conductive lines on the substrate, it simultaneously performs mechanical support and electrical connection functions, reducing the overall device complexity and bezel dimensions.
2Reliability
If an additional interconnection film is used to connect circuit boards, then electrical connection is achieved, but the thickness of the transparent display device is increased
Solution Approach 1:
The patent combines the interconnection function with the existing substrate by forming conductive lines directly on the transparent substrate. This eliminates the need for a separate interconnection film layer, thereby reducing the overall device thickness while maintaining electrical connectivity.
Solution Approach 2:
The patent uses thin conductive lines formed on the substrate instead of a thick interconnection film. This approach maintains the thin-film structure of the display device, preserving its sleek and compact form factor while achieving the necessary electrical connections.
3Ease of manufacture
If a printing process is used to manufacture the interconnection film, then manufacturing is simplified, but the width of the interconnection film increases due to spread lines
Solution Approach 1:
The patent transitions from a planar printing process that spreads lines to a multi-layered structure where conductive lines are formed on different layers of the substrate. This dimensional approach allows lines to be stacked vertically rather than spread horizontally, reducing the interconnection film width while maintaining manufacturability through sequential layer formation.
Solution Approach 2:
The patent implements a multi-layered structure where conductive lines are nested on different layers of the substrate. This nesting approach allows multiple connection paths to be stacked vertically, reducing the horizontal space required and thereby minimizing the interconnection film width while maintaining manufacturing simplicity.
Data Source
AI summary
A transparent organic light-emitting display device is described herein. The transparent substrate includes a display area and non-display area adjacent to the display area. An organic light-emitting element is disposed on the display area of the transparent substrate. A first power line is disposed on the display area of the transparent substrate. The first power line supplies power to the organic light-emitting element. A first circuit board comprises a first power supply provided on a first side of the transparent substrate and a second circuit board comprises a second power supply provided on a second side of the transparent substrate. The first power supply is configured to receive power from the second power supply via the first power line. An additional interconnection film to supply power to the first power supply is not required, and thus the width of the bezel can be reduced.