OLED Display Bezel Reduction via Vertical Circuit Nesting
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Solution Overview
Problem
Existing OLED display devices face challenges in minimizing the bezel region while ensuring the integrity of the sealing structure, as conventional methods often require a significant space for the driving circuit and sealant, which can lead to increased bezel width and potential moisture ingress, compromising the reliability of the OLEDs.
Innovation Solution
The display device design incorporates a driving circuit positioned directly below the sealant and laser-irradiated region, using refractory metals for the electrodes and wirings, and a low-melting-point metal for the first wiring unit to optimize the layout and minimize bezel width, while ensuring the sealant effectively bonds the substrates without damaging the transistors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the driving circuit and sealant are positioned in the bezel region, then the sealing structure is ensured, but the bezel width increases
Solution Approach 1:
The patent positions the driving circuit directly below the sealant in the thickness direction, utilizing the z-dimension (vertical space between substrates) rather than expanding the horizontal bezel region. This allows the driving circuit to be embedded within the sealing structure's vertical profile, effectively reducing the horizontal bezel width while maintaining both sealing integrity and circuit functionality.
Solution Approach 2:
The driving circuit is nested within the region occupied by the sealant in the thickness direction, with the sealant positioned above the driving circuit. This nesting arrangement allows the driving circuit to occupy space that would otherwise be unused in the vertical profile, enabling compact integration without increasing the horizontal footprint of the bezel region.
2Strength
If laser beam irradiation is used to melt the sealant, then bonding is achieved, but the transistor may be damaged due to heat
Solution Approach 1:
The patent applies different melting point characteristics to different metal layers: the sealant uses low-melting-point glass frit that melts at relatively low temperatures, while the transistor electrodes and wirings use high-melting-point refractory metals. This local differentiation of material properties allows the sealant to be melted and bonded without reaching temperatures that would damage the transistor structure.
Solution Approach 2:
The patent changes the temperature parameter by selecting materials with significantly different melting points. The sealant's low melting point allows it to be processed at temperatures that are insufficient to melt or damage the high-melting-point refractory metal electrodes and wirings of the transistor, thereby protecting the transistor integrity during the sealing process.
3Temperature
If refractory metals are used for electrodes and wirings, then heat resistance is improved, but manufacturing complexity increases
Solution Approach 1:
The patent changes the material parameter by selecting refractory metals with high melting points for the transistor electrodes and wirings. This material selection provides inherent heat resistance, allowing the components to withstand the laser irradiation process used to melt the sealant without requiring additional protective measures or process modifications.
Solution Approach 2:
The patent uses the same high-melting-point refractory metal material for both the transistor electrodes and the wirings. This material uniformity simplifies the manufacturing process by allowing a single deposition process or material source to be used for both components, reducing the complexity that would arise from using different materials with different processing requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for a narrower bezel region and stable power supply to the driving circuit, reducing the risk of moisture ingress and enhancing the reliability of the OLEDs by optimizing the layout and materials used in the sealing process.
Implementation Method 1
the substrate and the sealing glass are hermetically bonded with each other at the periphery
Implementation Method 2
By irradiating the paste through the sealing glass with a laser beam, the paste containing the powdered glass is melted
Implementation Method 3
the paste containing the powdered glass is melted
Implementation Method 4
an organic light emitting element that emits light based on current
Data Source
AI summary
The object is providing an organic light emitting display device achieving a narrow bezel. A display device 10 has a first substrate 11, a second substrate 12, a sealant 25 sealing between the substrates, a display unit 15 including pixel circuits, a driving circuit 20 including a transistor for driving the pixel circuits, a first wiring unit for supplying voltage to the transistor, and a second wiring unit connecting between the transistor and the first wiring unit. The driving circuit 20 is disposed outside the display unit 15, the first wiring unit is disposed between the display unit 15 and the driving circuit 20, the display unit 15 and the first wiring unit are disposed between the first substrate 12 and the second substrate 12, the melting point of a second metal constituting the second wiring unit is higher than that of a first metal constituting the first wiring unit.