Silicon OLED Display Substrate Binding Platform for Flat FPC Bonding
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Solution Overview
Problem
The existing silicon-based OLED display substrates face issues with reliable electrical connection and adhesive force between the flexible printed circuit and the display substrate due to a height difference in the film layer structure, leading to potential product failure and reduced reliability.
Innovation Solution
A binding platform is arranged on the same layer as the anode of the light emitting element in the binding area, connected to the bonding pad assembly via conductive pillars, which reduces the height difference and enables a flat film layer structure, allowing for reliable electrical connection and improved adhesive force through the use of anisotropic conductive films.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the film layer structure in the binding area has a height difference, then the bonding pad assembly can be connected to different power lines, but the adhesive force between the flexible printed circuit and the display substrate is reduced
Solution Approach 1:
The patent introduces a binding platform that extends horizontally from the silicon-based substrate surface, creating a stepped structure. This dimensional change allows the bonding pad assembly to be electrically connected to different power lines (first power line in display area, second power line in peripheral area) while maintaining a flat bonding surface for the flexible printed circuit, thus resolving the contradiction between electrical connection adaptability and adhesive strength.
Solution Approach 2:
The binding platform is integrated into the film layer structure of the display substrate, with the bonding pad assembly positioned on top of it. This nested configuration allows the bonding pad assembly to access multiple power lines through the binding platform while presenting a unified flat surface for external circuit bonding, simultaneously achieving electrical versatility and mechanical strength.
2Reliability
If the film layer structure has a height difference, then electrical connection between bonding pad assembly and power lines is achieved, but product reliability is reduced
Solution Approach 1:
The patent divides the binding area into distinct functional zones: the silicon-based substrate, the binding platform extending from it, and the bonding pad assembly on top. This segmentation allows each component to perform its specific function - the binding platform provides structural support and height adjustment, while the bonding pad assembly ensures reliable electrical connection, thereby improving reliability without excessive complexity.
3Strength
If a binding platform is added to reduce height difference, then adhesive force is improved, but device complexity increases
Solution Approach 1:
The binding platform serves multiple functions simultaneously: it reduces the height difference in the film layer structure, provides a flat bonding surface for the flexible printed circuit, and enables the bonding pad assembly to be electrically connected to different power lines. By making this single component multi-functional, the patent improves adhesive force without proportionally increasing device complexity.
Data Source
AI summary
Provided are a display substrate and a preparation method thereof, and a display apparatus. The display substrate includes a silicon-based substrate and an array structure layer arranged on the silicon-based substrate; a driving transistor and a first power line being arranged in the silicon-based substrate in the display area, a light emitting element being disposed on the array structure layer in the display area, a first electrode of the driving transistor being connected with the first power line, and a second electrode of the driving transistor being connected with an anode of the light emitting element; a power supply electrode and a second power line being arranged in the silicon-based substrate in the peripheral area, the power supply electrode being connected with the second power line.