OLED Blocking Structure Metal Interlayer Delamination
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Solution Overview
Problem
The manufacturing process for flexible organic light emitting diode (OLED) display devices faces issues with contact failure due to reduced roughness of the insulating layer under the blocking structure, leading to potential delamination between the upper blocking member and the insulating interlayer.
Innovation Solution
Incorporating a metal member between the upper blocking member and the insulating interlayer, and ensuring the connection electrode completely overlaps the lower blocking member to prevent direct contact between the upper blocking member and the insulating interlayer, thereby enhancing adhesion and preventing delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the etchant is changed to reduce insulating layer roughness, then manufacturing precision is improved, but contact area between blocking structure and insulating layer is reduced causing contact failure
Solution Approach 1:
A metal member is introduced as an intermediary component between the upper blocking member and the insulating interlayer. This metal member has a larger contact area with the insulating interlayer compared to the reduced roughness contact area, thereby ensuring reliable electrical contact while allowing the use of etchants that produce smoother insulating layers
Solution Approach 2:
The patent changes the contact interface parameters by introducing a metal member with different material properties and contact area characteristics. The metal member provides an alternative contact path with optimized contact area parameters, compensating for the reduced roughness-induced contact area
2Strength
If the contact area between upper blocking member and insulating interlayer is reduced, then adhesion is improved, but delamination resistance is worsened
Solution Approach 1:
The metal member serves as a mediator that decouples the adhesion interface from the delamination-prone interface. By providing a separate metal-to-insulating interlayer contact path with larger area, it prevents delamination while maintaining the desired adhesion characteristics at the primary interface
Solution Approach 2:
The patent extends the contact interface into another dimensional space by adding the metal member layer. This creates a multi-layered contact structure where the metal member provides additional contact area in the vertical stacking direction, thereby improving delamination resistance without compromising adhesion
Data Source
AI summary
An organic light emitting diode display device includes a substrate, a pixel structure, a lower blocking member, an upper blocking member, and a metal member. The substrate includes a display area and a peripheral area. The pixel structure is in the display area on the substrate. The lower blocking member is in the peripheral area on the substrate and surrounds the pixel structure, and includes a first side surface adjacent to the pixel structure, a second side surface, and a top surface. The upper blocking member is on the top surface and the second side surface of the lower blocking member, and constitutes a first blocking structure with the lower blocking member. The metal member is between the first blocking structure and the substrate while making contact with a bottom surface of the upper blocking member on the second side surface of the lower blocking member.