OLED Display Panel Bonding Area Glass Substrate Hardness
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current display panel manufacturing processes, particularly in OLED technology, face issues with damage to bonding areas due to excessive pressure during the laser lift-off and bending processes, which can harm terminals and require excessive support layer handling.
Innovation Solution
Substituting a glass substrate for the traditional support layer in the bonding area, providing increased hardness and reducing damage from external forces, while simplifying the bonding process by preserving the glass substrate during laser lift-off and attachment to the display area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a support layer is used to protect the flexible panel after laser lift-off, then the panel is protected during handling, but the terminals in the bonding area are easily damaged due to excessive pressure during bending and transportation
Solution Approach 1:
The panel is divided into different functional areas with different substrate materials: the display area uses a flexible support layer for protection, while the bonding area retains the original glass substrate to provide hardness protection for terminals. This segmentation allows each area to have optimized properties for its specific function.
Solution Approach 2:
Different parts of the panel have different mechanical properties: the bonding area maintains the hard glass substrate characteristics to protect terminals from pressure damage, while the display area uses the flexible support layer for overall panel protection. This local quality differentiation resolves the contradiction between protection and terminal safety.
2Adaptability or versatility
If the glass substrate is completely removed by laser lift-off, then the flexible panel can be bent and folded, but the bonding area lacks sufficient hardness protection during subsequent handling and transportation
Solution Approach 1:
The laser lift-off process is selectively applied only to the display area to remove the glass substrate and enable flexibility, while the bonding area retains the original glass substrate for hardness protection. This selective segmentation resolves the contradiction between flexibility and strength.
Solution Approach 2:
Different regions of the panel have different substrate configurations: the display area has removed glass for flexibility, while the bonding area preserves glass for hardness. This local quality differentiation allows the panel to achieve both adaptability for bending and strength for terminal protection.
3Reliability
If additional bonding steps are added to attach the bonding area to the support layer, then terminal protection is improved, but the manufacturing process complexity and time increase
Solution Approach 1:
The bonding area is integrated with the original glass substrate rather than being separately bonded to the support layer. This merging eliminates additional bonding steps and reduces manufacturing complexity while maintaining terminal protection through the inherent hardness of the glass substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The glass substrate enhances the durability of terminals in the bonding area, reducing damage and simplifying the manufacturing process by eliminating the need for additional bonding steps, thus improving safety and efficiency in OLED display panel production.
Implementation Method 1
a glass substrate is peeled off from a display area and a bending area through laser lift-off technology
Data Source
AI summary
A display panel comprises a display area, a bending area and a bonding area. The bending area is connected to the bonding area and the display area, the bonding area is disposed under the display area, and the bonding area is attached to the display area by at least one glass substrate. A glass substrate is substituted for current support layer in the bonding area. The glass substrate has a greater hardness compared to the support layer, and can reduce damages to the terminals in the bonding area caused by an external force.