OLED Sub-Pixel Bonding Layer Thickness for Signal Reliability
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Solution Overview
Problem
Existing OLED display devices face challenges in maintaining electrical signal reliability due to altered electrical characteristics in conductive lines, which can compromise the light-emitting element's reliability and integrity.
Innovation Solution
The display device incorporates a semiconductor wafer with a substrate, a bonding conductive layer of varying thicknesses, and an interlayer insulating layer with different thicknesses in sub-pixel areas, along with a reflective conductive layer and partition walls to enhance electrical connectivity and signal reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If uniform thickness bonding conductive layers are used across all sub-pixel areas, then manufacturing process is simplified, but electrical signal reliability deteriorates due to altered electrical characteristics in conductive lines
Solution Approach 1:
The bonding conductive layer is designed with different thicknesses in different sub-pixel areas (first sub-pixel area vs. second sub-pixel area). This local variation in thickness allows optimization of electrical characteristics for each specific area, improving overall electrical signal reliability while maintaining manufacturing feasibility through controlled thickness variations rather than complete structural redesign
2Reliability
If different thicknesses are used for bonding conductive layers in different sub-pixel areas, then electrical signal reliability is improved, but manufacturing process complexity increases
Solution Approach 1:
The invention changes the thickness parameter of the bonding conductive layer across different sub-pixel areas to optimize electrical characteristics. By controlling this physical parameter (thickness) to vary in specific regions, the patent achieves improved electrical signal reliability while managing manufacturing precision requirements through established thin-film deposition techniques that can control thickness variations
3Ease of manufacture
If conductive lines have altered electrical characteristics, then manufacturing flexibility is improved, but light emitting element reliability deteriorates
Solution Approach 1:
The bonding conductive layer implements local quality variations with different thicknesses in different sub-pixel areas. This allows the conductive lines to have optimized electrical characteristics tailored to each area's specific requirements, ensuring light emitting element reliability while maintaining manufacturing flexibility through controlled local variations rather than uniform structures
Data Source
AI summary
A display device, a method of manufacturing the same, and an electronic device comprising the same are provided. The display device includes a pixel comprising sub-pixel areas, sub-pixel areas including a first sub-pixel area and a second sub-pixel area. The display device includes a semiconductor wafer including a substrate; a bonding conductive layer on the semiconductor wafer; a reflective conductive layer on the bonding conductive layer; and a light emitting element electrically connected to the reflective conductive layer. The bonding conductive layer includes a first bonding conductive layer in the first sub-pixel area and a second bonding conductive layer in the second sub-pixel area. The first bonding conductive layer and the second bonding conductive layer have different thicknesses.