OLED Bonding Pad Segmentation for Yield
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Solution Overview
Problem
The design of bonding pads in OLED display panels faces challenges in achieving a small fine pitch design, which complicates the bonding process and increases costs due to the need for a large overlap area and adequate distance between pads to prevent short circuits.
Innovation Solution
The bonding pads are arranged in a longitudinal rectangle shape with alternating first and second bonding pad units forming a concave and convex boundary, increasing the overlap area with the peripheral circuit while maintaining the distance between pads, thereby enhancing production yield and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If regular rectangular bonding pads are used in OLED display panels, then the bonding process can be simplified, but the overlap area between peripheral circuit and display panel is reduced and the distance between adjacent bonding pads becomes insufficient, leading to short circuit risks
Solution Approach 1:
The bonding pad is divided into multiple units (first bonding pad units and second bonding pad units) arranged in an alternating pattern along the long sides of the rectangular structure. This segmentation increases the effective overlap area while maintaining adequate spacing between adjacent bonding pad units, thus preventing short circuits while enhancing bonding reliability
Solution Approach 2:
The bonding pad structure transitions from a simple symmetric rectangle to an asymmetric configuration with alternating bonding pad units on opposite long sides. This asymmetric arrangement optimizes the overlap area distribution and ensures sufficient distance between adjacent bonding units, resolving the contradiction between reliability and structural simplicity
2Productivity
If the overlap area between peripheral circuit and display panel is increased to improve bonding efficiency, then the distance between adjacent bonding pads decreases, increasing the risk of short circuits
Solution Approach 1:
By segmenting the bonding pad into multiple alternating units, the total overlap area is distributed across multiple contact points rather than one large continuous area. This segmentation allows the bonding process to be more efficient while maintaining sufficient spacing between units to prevent short circuits between adjacent bonding pads
Solution Approach 2:
Different regions of the bonding pad structure serve different functions: the alternating bonding pad units provide localized contact areas for efficient bonding, while the spaces between units maintain the necessary insulation distance. This local quality differentiation resolves the contradiction between bonding efficiency and short circuit prevention
Data Source
AI summary
The present disclosure provides a display panel and a display device including the display panel. The display panel may include a bonding pad having a bonding pad body, a plurality of first bonding pad units, and a plurality of second bonding pad units; the plurality of first bonding pad units and the plurality of second bonding pad units being arranged on both sides of the bonding pad body; wherein the plurality of first bonding pad and the plurality of second bonding pad units are arranged alternately, to form a boundary with a concave and convex changing. By processing the bonding pad to forming the boundary with the concave and convex changing, an area of an overlap where a peripheral circuit is contacted the display panel may be increased, and an efficiency of a production yield of bonding process may be increased and a cost may be reduced.