OLED Display Panel Bonding Pad Coverage via Single Mask Deposition
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Solution Overview
Problem
The complex and costly OLED panel manufacturing process requires different mask openings for depositing the cathode and electron transport/electron injection layers, leading to a need for multiple cyclic processes and high equipment investment, as well as issues with the overlap of the cathode film layer and metal wiring.
Innovation Solution
A display panel design that divides the substrate into a display region and a bonding region, with the organic electronic functional layer and cathode extending into the bonding region to cover the bonding pad pattern, using a single mask for deposition to simplify the process and prevent overlap, and a manufacturing method that adjusts evaporation or sputtering parameters to achieve overspray coverage of the bonding pad pattern.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If different mask openings are used for depositing cathode and electron transport/electron injection layers, then the film formation area can be differentiated to prevent poor conductive films from covering metal traces, but the manufacturing process becomes complex requiring at least two circulation processes and high equipment investment
Solution Approach 1:
The patent merges the deposition of multiple layers (cathode, electron transport layer, electron injection layer) into a single circulation process using one mask. The mask opening is designed with a specific size that allows all these layers to be deposited simultaneously without requiring multiple separate deposition processes, thereby simplifying the manufacturing process while maintaining reliable lap connections.
Solution Approach 2:
The single mask opening serves multiple functions: it defines the deposition area for the cathode, electron transport layer, and electron injection layer simultaneously. This universal mask design eliminates the need for different mask openings for different layers, reducing process complexity while ensuring proper film formation and lap connections.
2Manufacturing precision
If different mask openings are used for depositing cathode and electron transport/electron injection layers, then proper film formation area can be achieved, but equipment investment cost increases due to requiring at least two circulation processes
Solution Approach 1:
The patent combines multiple deposition operations into a single circulation process, reducing the number of required equipment cycles from at least two to one. This merging approach maintains precise film formation area control through a single optimized mask opening while significantly reducing equipment investment costs and manufacturing complexity.
3Device complexity
If the cathode film layer overlaps with metal wiring, then the manufacturing process can be simplified, but the electrical connection reliability is affected
Solution Approach 1:
The patent applies local quality control by designing the mask opening with specific dimensions that precisely define the cathode deposition area. This localized approach ensures the cathode forms only where needed (on the bonding pad pattern) without overlapping with metal wiring, maintaining both process simplification and electrical connection reliability through optimized local film formation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process by eliminating the need for multiple masks and cyclic processes, ensuring a good electrical connection between the cathode and bonding pad pattern while reducing equipment costs and preventing overlap, thus enhancing the efficiency and cost-effectiveness of OLED panel production.
Implementation Method 1
a manufacturing method that adjusts evaporation or sputtering parameters to achieve overspray coverage of the bonding pad pattern
Implementation Method 2
a manufacturing method that adjusts evaporation or sputtering parameters to achieve overspray coverage of the bonding pad pattern
Data Source
AI summary
A display panel, a method of manufacturing a display panel, and a machine of manufacturing a display panel are provided. The display panel includes the plurality of stacked metal sub-layers and the first passivation sub-layer and the second passivation sub-layer stacked. The first passivation sub-layer is disposed between the metal layer and the second passivation layer. Material of the first passivation sub-layer includes silicon nitride. The first passivation sub-layer covers the untidy area at the ends of the molybdenum-titanium alloy thin layer to avoid from detachment of the passivation layer, and meanwhile to solve the issues of simplifying the manufacturing process of the display panel, and to avoid from oxidation of the bonding pads.