OLED Display Panel Bonding Test Circuit for Fan-Out Line Detection
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Solution Overview
Problem
Conventional OLED display panels and devices lack effective methods to detect abnormal fan-out data lines in the bonding region, leading to unidentified issues during the bonding process.
Innovation Solution
Incorporating a bonding test circuit between the bonding region and the first fan-out line region, comprising a first test input line, a second test input line, a test data line, and thin film transistors (TFTs) to detect abnormalities in fan-out data lines by controlling the on/off state of TFTs and inputting test data signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If bonding test circuit is added to detect fan-out data line abnormalities, then detection capability is improved, but device complexity increases
Solution Approach 1:
The patent divides the bonding region into multiple test segments by introducing a bonding test circuit with multiple test input lines (first test input line, second test input line) and corresponding thin film transistors. Each TFT controls a specific fan-out data line, allowing segmented detection of bonding abnormalities along the data lines without requiring complex comprehensive testing of all lines simultaneously.
Solution Approach 2:
The patent introduces a bonding test circuit as an intermediary testing system between the bonding region and fan-out line region. This test circuit includes test input lines and TFTs that act as mediators to detect bonding abnormalities indirectly by monitoring signal transmission through the fan-out data lines, avoiding direct complex measurement of the bonding interface itself.
2Device complexity
If conventional bonding process is used without test circuit, then device complexity is reduced, but reliability of bonding process deteriorates
Solution Approach 1:
The patent implements preliminary bonding detection by incorporating a bonding test circuit that can detect abnormalities in fan-out data lines before they cause complete bonding failure. The test circuit allows early identification of bonding issues through signal transmission testing, enabling corrective actions before the bonding process becomes irreparably compromised.
Solution Approach 2:
The patent establishes a feedback mechanism through the bonding test circuit that monitors the bonding process in real-time. The test input lines and TFTs provide continuous feedback on the status of fan-out data lines, allowing the bonding process to be adjusted or corrected based on detected abnormalities, thereby improving overall bonding reliability.
Data Source
AI summary
An organic light-emitting diode (OLED) display panel and an OLED display device have a display region and a non-display region surrounding the display region. The non-display region includes a bonding region, a first fan-out line region, a bending region, and a second fan-out line region. A bonding test region is arranged between the bonding region and the first fan-out line region, a bonding test circuit is arranged in the bonding test region, and the bonding test circuit is used to detect whether a fan-out data line passing through the bonding region is abnormal.