OLED Buffer Layer for Flatness and Adhesion

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Solution Overview

Problem

Current OLED technologies face challenges in achieving an improved light-emitting surface with effective hole injection and emission, often resulting in defects like 'dark spots' due to contamination and unevenness, particularly when using flexible substrates and polymeric planarization layers.

Innovation Solution

The implementation of an organic light-emitting diode (OLED) structure featuring a substrate with a buffer layer and organic layer stack formed from small molecules, where the buffer layer is directly adjacent to the electrode and compatible with the organic layer stack materials, and a polymeric planarization layer to compensate substrate unevenness, ensuring congruent alignment and adhesion, thereby reducing defects and enhancing light emission.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Shape

If a polymeric planarization layer is used to compensate substrate unevenness, then substrate flatness is improved, but contamination and dark spots increase

Engineering Contradiction:
Improvesubstrate flatnessVSAvoidcontamination and dark spots
Core Design Contradiction:
ShapeVSObject-affected harmful factors

Solution Approach 1:

The patent introduces an organic buffer layer as an intermediary between the polymeric planarization layer and the electrode/organic layer stack. This buffer layer mediates the interaction by providing a clean interface that prevents contamination from the polymeric layer while maintaining the flatness compensation function. The buffer layer acts as a protective barrier that eliminates dark spots caused by direct contact between the polymeric planarization layer and subsequent layers.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent segments the planarization function from the interface function by separating the polymeric planarization layer from the electrode/organic layer stack through an organic buffer layer. This segmentation allows the polymeric layer to focus on flatness compensation while the buffer layer handles the interface quality, preventing contamination and dark spots at the critical interface.

Inventive Principle:
Principle #1Segmentation

2Manufacturing precision

If the organic layer stack and buffer layer have equal lateral extent, then manufacturing precision is improved, but adhesion and defect reduction are compromised

Engineering Contradiction:
Improvelateral alignmentVSAvoidadhesion and defect reduction
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent applies local quality by giving the buffer layer a larger lateral extent than the organic layer stack. This local extension of the buffer layer beyond the stack boundaries provides enhanced adhesion areas and defect coverage at the edges, while the central region maintains precise alignment. The buffer layer's extended perimeter locally improves reliability without compromising overall manufacturing precision.

Inventive Principle:
Principle #3Local quality

3Adaptability or versatility

If small molecule organic materials are used in the organic layer stack, then material compatibility is improved, but manufacturing complexity increases

Engineering Contradiction:
Improvematerial compatibilityVSAvoidmanufacturing complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent uses homogeneity by forming both the buffer layer and the organic layer stack from the same small molecule organic material. This material homogeneity ensures excellent compatibility between layers, simplifies the manufacturing process by using a single material system, and eliminates the need for separate material deposition processes. The uniform material composition throughout the buffer layer and organic stack ensures proper interface formation and device performance.

Inventive Principle:
Principle #33Homogeneity

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances the light-emitting surface by reducing defects, improving adhesion, and increasing the out-coupling of radiation, while maintaining manufacturing tolerances and material compatibility, resulting in a more efficient and reliable OLED production method.

Implementation Method 1

Materials having a radiation emission due to fluorescence or phosphorescence such as 2- or 2,5-substituted poly-p-phenylene vinylene

Methodology Applied
Scientific EffectFluorescence: Fluorescence

Implementation Method 2

Materials having a radiation emission due to fluorescence or phosphorescence such as 2- or 2,5-substituted poly-p-phenylene vinylene, as well as metal complexes

Methodology Applied
Scientific EffectPhosphorescence: Phosphorescence

Implementation Method 3

a polymeric planarization layer to compensate substrate unevenness

Methodology Applied
Scientific EffectPlanarization:

Implementation Method 4

ensuring congruent alignment and adhesion

Methodology Applied
Scientific EffectAdhesion: Adhesive

Data Source

PatentUS9911934B2OLED and method for producing an OLED
Publication Date: 2018.03.06 DOLYA HOLDCO 5 LTD
  • US9911934B2 patent drawing
  • US9911934B2 patent drawing
  • US9911934B2 patent drawing

AI summary

An OLED and a method for producing an OLED are disclosed. In an embodiment, the OLED includes a substrate and an organic layer stack with at least one active light-generating layer, which is suitable for generating electromagnetic radiation, wherein the organic layer stack is arranged between a first electrode and a second electrode. The OLED further includes a buffer layer arranged between the substrate and the first electrode, wherein the buffer layer includes an organic material, wherein a polymeric planarization layer is in direct contact with the substrate, wherein the buffer layer is in direct contact with the polymeric planarization layer, and wherein the first electrode is in direct contact with the buffer layer.