OLED Display Buffer Openings for Lower-Complexity Bending Fabrication
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Solution Overview
Problem
Existing organic light emitting display (OLED) devices face challenges in manufacturing processes due to the need for multiple mask processes to remove inorganic insulation layers in bending regions, which increases complexity and cost.
Innovation Solution
The OLED device is designed with a substrate that includes a display region, a bending region, and a pad region, where a buffer layer with specific openings is used to expose the substrate surface in the bending region. This allows for the removal of inorganic insulation layers through etching processes, reducing the number of mask processes required.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple mask processes are used to remove inorganic insulation layers in bending regions, then the OLED device can be bent, but the manufacturing complexity and cost increase
Solution Approach 1:
The device is divided into distinct regions: a display region with complete insulation layers, a bending region with removed inorganic insulation layers, and a pad region. This segmentation allows the bending region to be flexible while maintaining the protective insulation in the display region, resolving the contradiction between bendability and manufacturing complexity.
Solution Approach 2:
Different structural properties are applied to different regions of the device. The bending region has removed inorganic insulation layers to enable flexibility, while the display region maintains complete insulation layers for protection. This local differentiation allows the device to achieve bending capability without requiring complex mask processes across the entire structure.
2Manufacturing precision
If multiple mask processes are used to remove inorganic insulation layers, then the inorganic insulation layers can be selectively removed, but the number of manufacturing steps increases
Solution Approach 1:
The buffer layer is designed with a specific structure that includes an opening in the bending region before the insulation layer formation. This preliminary structural preparation allows subsequent insulation layers to be formed only in regions where they are needed, eliminating the need for multiple mask processes to remove insulation later and improving manufacturing efficiency.
Solution Approach 2:
The inorganic insulation layers are extracted or removed from the bending region while being retained in the display region. This selective extraction achieves the desired precision in insulation layer distribution without requiring multiple complex mask processes, thereby improving manufacturing efficiency.
3Ease of operation
If inorganic insulation layers are removed in bending region, then the device can be readily bent, but additional etching processes are required
Solution Approach 1:
The buffer layer is pre-formed with an opening in the bending region before subsequent insulation layers are deposited. This preliminary action creates a built-in structure that facilitates bending without requiring additional etching processes to remove insulation layers later, thus maintaining bending ease while reducing process complexity.
Data Source
AI summary
An organic light emitting display device includes a substrate. A buffer layer is disposed on the substrate. The buffer layer includes a first opening exposing an upper surface of the substrate in a bending region. Pixel structures are positioned in a pixel region on the buffer layer. A fan-out wiring is positioned in the peripheral region and the pad region on the insulation layer structure such that the upper surface of the substrate and the first portion of the buffer layer are exposed. A passivation layer is disposed on the fan-out wiring, side walls of the insulation layer structure adjacent to the bending region, and the first portion of the buffer layer. The passivation layer includes a third opening exposing the upper surface of the substrate in the bending region. A connection electrode is positioned in the bending region on the substrate.