OLED Panel Assembly Compression Buffer Tape Impact Resistance
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Solution Overview
Problem
Organic light-emitting display devices are vulnerable to impact due to their thin substrates and empty panel assembly, leading to easy damage from external forces like dropping.
Innovation Solution
Incorporating a compressible buffer member, such as a compression buffer tape, between the frame and the panel assembly to absorb and distribute impact forces, minimizing the maximum separation distance between the substrates and reducing tensile stress on the sealant.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the panel assembly uses thin substrates to reduce device thickness, then the display device achieves a thinner and more compact design, but the impact resistance deteriorates making the device vulnerable to damage from dropping
Solution Approach 1:
A buffer member is pre-installed between the first substrate and the frame before the panel assembly is assembled. This buffer member is positioned to absorb impact forces before they can reach the thin substrates, preventing damage while maintaining the thin design. The buffer member is compressed during normal operation to maintain contact, ensuring it is ready to absorb impact forces when needed.
2Device complexity
If the panel assembly structure is simplified without buffer components, then the device complexity is reduced, but the reliability deteriorates due to increased vulnerability to impact damage
Solution Approach 1:
The buffer member is designed as a thin, flexible component that can be integrated into the existing panel assembly structure without adding significant complexity. The buffer member is positioned between the first substrate and the frame, utilizing the existing structural elements while providing impact protection. This approach maintains reliability improvement while minimizing the increase in device complexity.
3Ease of manufacture
If no buffer member is used, then the manufacturing process remains simple, but the sealant experiences high tensile stress during impact causing potential damage
Solution Approach 1:
The buffer member acts as an intermediary element between the first substrate and the frame, absorbing impact forces before they can be transmitted to the sealant. This mediator component reduces the tensile stress on the sealant during impact events, protecting the sealant from damage while requiring minimal changes to the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The compressible buffer member effectively reduces the impact energy transmitted to the panel assembly, preventing damage to the substrates and sealant, thereby enhancing the impact resistance of the organic light-emitting display device.
Implementation Method 1
a compression buffer tape 115 arranged between the frame 113 and the panel assembly 105... The compression buffer tape 115 may be compressed by the panel assembly
Implementation Method 2
A compressive force applied to the compression buffer tape may vary according to location... The compression buffer tape may minimize a maximum separation distance between the first substrate and the second substrate upon impact
Data Source
AI summary
An organic light-emitting display device having improved impact resistance by including a buffer member for reducing an external impact, and electronic equipment including the organic light-emitting display device. The organic light-emitting display device includes a frame, a panel assembly and a compression buffer tape arranged between the frame and the panel assembly, wherein the panel assembly includes a first substrate, a display unit arranged on a surface of the first substrate, a second substrate arranged to face the first substrate and a sealant arranged along edges of the first substrate and the second substrate to attach the second substrate to the first substrate.