Encapsulation Cap Bead Reinforcement for OLED Thickness Reduction

The patent applies local quality by forming beads at specific locations on the cap surface. These beads are not distributed uniformly but are strategically positioned to provide localized reinforcement where structural support is most needed, particularly at the center and edges of the cap, while maintaining thin thickness in other areas.

The patent utilizes curvature by forming beads with rounded surfaces on the cap. These spherical or hemispherical protrusions distribute stress more effectively compared to flat surfaces, providing enhanced structural strength against deformation while adding minimal thickness. The curved geometry of beads helps resist external pressure and prevents the thin cap from bending.

The beads are strategically positioned at critical locations where deformation would most likely occur and cause contact with structural elements. This localized reinforcement ensures that the thin cap maintains its shape and prevents line failures without requiring increased thickness throughout the entire cap structure.

The spherical geometry of the beads provides superior resistance to deformation compared to flat or angular structures. The curved surfaces distribute applied forces evenly, preventing localized bending that would cause the cap to contact underlying structural elements and cause device failure.