OLED Encapsulation Substrate with Carbon Fiber Conductive Layers
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Solution Overview
Problem
Organic light emitting diode (OLED) displays face deterioration due to external moisture and oxygen penetration, which existing sealing technologies fail to adequately address, particularly in large-sized displays, leading to luminance non-uniformity and increased manufacturing complexity.
Innovation Solution
An OLED display with an encapsulation substrate featuring a resin matrix and carbon fibers, where conductive portions on the substrate supply electrical signals to the common power line and electrode, enhancing sealing functionality and luminance uniformity while simplifying the structure and manufacturing process by reducing the number of parts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If existing sealing technologies are used for OLED displays, then the structure and manufacturing process remain complex, but the sealing function against moisture and oxygen penetration is insufficient
Solution Approach 1:
The patent merges the sealing function and electrical signal transmission function into a single encapsulation substrate. The encapsulation substrate simultaneously provides moisture and oxygen barrier protection while incorporating conductive portions to supply electrical signals to the common power line and electrode, eliminating the need for separate sealing structures and conductive layers.
Solution Approach 2:
The encapsulation substrate is designed as a multi-functional component that performs multiple roles: (1) sealing the display unit to prevent moisture and oxygen penetration, (2) providing electrical connection through integrated conductive portions, and (3) maintaining structural integrity. This universal design reduces the total number of components and simplifies the manufacturing process.
2Illumination intensity
If existing sealing technologies are used for large-sized OLED displays, then manufacturing complexity increases, but luminance uniformity deteriorates
Solution Approach 1:
By combining the sealing and electrical signal transmission functions into one encapsulation substrate, the patent reduces the number of manufacturing steps and alignment requirements. This integrated approach simplifies the manufacturing process for large-sized displays while ensuring uniform luminance output through proper design of the conductive portions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively increases the sealing function and luminance uniformity of OLED displays, particularly in large-sized units, while reducing the complexity of the manufacturing process and preventing moisture and oxygen penetration.
Implementation Method 1
the encapsulation substrate includes a resin matrix and a plurality of carbon fibers... the first conductive portion is adapted to supply a first electrical signal to the common power line... the second conductive portion is adapted to supply a second electrical signal to the common electrode
Implementation Method 2
the encapsulation substrate includes a resin matrix and a plurality of carbon fibers
Implementation Method 3
The function of the display unit including a plurality of organic light emitting elements may be deteriorated by, e.g., penetration of external moisture and oxygen. As such, a technology for sealing the display unit to suppress the penetration of external moisture and oxygen may be very important.
Data Source
AI summary
An organic light emitting diode display includes a substrate, a display unit that includes a common power line and a common electrode, an encapsulation substrate that is attached to the substrate by an adhering layer enclosing the display unit and includes a resin matrix and a plurality of carbon fiber. The display includes a first conductive portion and a second conductive portion. The first conductive portion is on a first inner surface region, a first side surface region, and a first outer surface region of the encapsulation substrate. The first conductive portion is adapted to supply a first electrical signal to the common power line. The second conductive portion is on a second inner surface region, a second side surface region, and a second outer surface region of the encapsulation substrate. The second conductive portion is adapted to supply a second electrical signal to the common electrode.