Surface Modification Layer for OLED Carrier Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current methods for processing thin glass sheets on carriers in FPD manufacturing face challenges such as contamination, loss of bond strength at high temperatures, and inability to reuse carriers due to permanent covalent bonding, which limits the flexibility and efficiency of display device production.
Innovation Solution
The use of surface modification layers on thin glass sheets and carriers to control van der Waals and covalent bonding, allowing for a temporary bond strong enough to withstand FPD processing but weak enough to permit debonding after high-temperature processing, enabling carrier reuse and maintaining hermeticity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive wafer bonding is used to bond thin glass sheet to carrier, then bond strength is improved, but contamination of FPD processes occurs due to outgassing of volatiles and solvents
Solution Approach 1:
The patent employs a disposable release film that is discarded after use, eliminating the need for complex adhesive removal processes and preventing contamination from adhesive outgassing during FPD processing
Solution Approach 2:
The patent extracts the bonding function from the final device structure by using a release film that bonds temporarily during processing and is then removed, separating the bonding need from the final product
2Strength
If covalent bonding is used to bond thin glass sheet to carrier, then bond strength at high temperature is improved, but carrier reuse becomes impossible due to permanent bonding
Solution Approach 1:
The patent creates a dynamic bonding system where the release film provides temporary bonding strength during high-temperature processing and can be easily removed afterward, enabling carrier reuse through controlled bond duration
Solution Approach 2:
The release film is applied beforehand to provide the necessary bonding strength for high-temperature processing, and its removal is performed as a preliminary step before carrier reuse
3Ease of manufacture
If thick polymer adhesive layers are used for bonding, then ease of bonding is improved, but outgassing and contamination in downstream processes increases
Solution Approach 1:
The patent uses a thin release film instead of thick polymer adhesive layers, providing sufficient bonding strength while minimizing the material that can outgas and contaminate downstream FPD processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the successful processing of thin glass sheets through harsh FPD environments, including high temperatures, while enabling easy removal from the carrier without damage, thus facilitating the reuse of carriers and reducing contamination risks.
Implementation Method 1
surface modification layers on the thin sheet and the carrier control van der Waals and covalent bonding between the thin sheet and the carrier
Implementation Method 2
surface modification layers on the thin sheet and the carrier control van der Waals and covalent bonding between the thin sheet and the carrier
Data Source
Figure 1~6
Figure 2
Figure 3~5
AI summary
Methods for making electronic devices on thin sheets (20) bonded to carriers (10). A surface modification layer (30) and associated heat treatments, may be provided on a sheet (20), a carrier (10), or both, to control both room-temperature van der Waals (and/or hydrogen) bonding and high temperature covalent bonding between the thin sheet and carrier during the electronic device processing. The room-temperature bonding is controlled so as to be sufficient to hold the thin sheet and carrier together during vacuum processing, wet processing, and/or ultrasonic cleaning processing, during the electronic device processing. And at the same time, the high temperature covalent bonding is controlled so as to prevent a permanent bond between the thin sheet and carrier during high temperature processing, during the electronic device processing, as well as maintain a sufficient bond to prevent delamination during high temperature processing.