Hybrid OLED Carrier Singulation via Planar Structure Separation

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Solution Overview

Problem

Conventional methods for singulating hybrid OLED carriers, which include glass and plastic or metal films, are inefficient due to the inability to simultaneously separate different materials using scribe wheels and the high costs and complexity of laser-based separation methods, leading to defects and increased production costs.

Innovation Solution

A method involving the application of a planar structure with predetermined separation locations, which can be made of flexible materials like films or metals, allowing for selective separation and exposure of contact areas without damaging the OLED, using techniques like water jet cutting or laser ablation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a scribe wheel is used to separate glass and plastic films simultaneously, then the separation process is simplified, but the plastics film yields or springs back during scribing resulting in incomplete separation

Engineering Contradiction:
Improveseparation process simplicityVSAvoidseparation completeness
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent divides the separation process into two distinct stages: first separating the glass substrate from the plastic film using a scribe wheel, then removing the plastic film separately using a lifting wheel. This segmentation allows each material to be handled with an appropriate method, preventing the plastic film from springing back during the initial scribing phase.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The plastic film is pre-structured with separation lines before the scribing process begins. This preliminary action creates predetermined weak points in the plastic film that guide the separation process and prevent uncontrolled springing back during subsequent removal steps.

Inventive Principle:
Principle #10Preliminary action

2Manufacturing precision

If laser methods are used to separate glass and plastic films, then selective separation is achieved, but the equipment cost and maintenance cost increase significantly

Engineering Contradiction:
Improveselective separation capabilityVSAvoidequipment cost and maintenance
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent replaces expensive laser separation equipment with conventional mechanical scribe wheels and lifting wheels that are much cheaper to acquire and maintain. While the mechanical tools have limited life, their low cost and simplicity make them economically advantageous compared to expensive laser systems requiring specialized maintenance.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The patent substitutes optical/laser-based separation with a mechanical two-stage process. Instead of using high-energy laser beams to selectively vaporize materials, the invention uses mechanical scribing followed by mechanical lifting, replacing complex optical systems with simpler mechanical tools.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Measurement precision

If metal films are trimmed and laminated individually onto OLEDs, then precise positioning is achieved, but particles are incorporated between film and OLED increasing the risk of short circuits

Engineering Contradiction:
Improvefilm positioning accuracyVSAvoidshort circuit risk
Core Design Contradiction:
Measurement precisionVSReliability

Solution Approach 1:

The patent combines multiple film processing operations into a single continuous lamination step. Instead of trimming and laminating metal films individually for each OLED, the invention laminates the entire metal film structure onto the complete OLED array in one operation, eliminating repeated handling that introduces particles and short circuit risks.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The metal films are pre-positioned and pre-aligned on the OLED array before the final lamination step. This preliminary action ensures precise positioning is achieved before the films are permanently bonded, eliminating the need for subsequent individual adjustments that would increase contamination risk.

Inventive Principle:
Principle #10Preliminary action

4Manufacturing precision

If glass substrates are scribed at front and rear sides with subsequent breaking, then individual devices are formed, but the process is time-consuming and affects productivity

Engineering Contradiction:
Improvesingulation accuracyVSAvoidproduction speed
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The plastic film is pre-structured with separation lines and pre-aligned with the glass substrate before the scribing process. This preliminary preparation ensures that subsequent breaking occurs precisely at the intended locations without requiring multiple adjustment steps, maintaining high singulation accuracy while reducing overall process time.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent segments the singulation process into distinct phases: pre-structuring the plastic film with separation lines, scribing the glass substrate along predetermined paths, and final breaking. This segmentation allows each step to be optimized independently, improving both precision and throughput compared to unoptimized sequential processes.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables simple and cost-effective singulation of hybrid OLED carriers and exposure of contact areas, reducing production costs and improving the quality of individual OLED devices by allowing selective separation of materials with conventional methods.

Implementation Method 1

using techniques like water jet cutting or laser ablation

Methodology Applied
Scientific EffectLaser ablation: Laser Ablation

Data Source

PatentUS9741965B2Method for processing an electronic component and electronic component arrangement
Publication Date: 2017.08.22 DOLYA HOLDCO 5 LTD
  • US9741965B2 patent drawing
  • US9741965B2 patent drawing
  • US9741965B2 patent drawing

AI summary

Various embodiments may relate to a method for processing an electronic component. The method includes applying a planar structure provided with predetermined separation locations to the electronic component, and removing a part of the applied planar structure, wherein removing includes separating the planar structure at the predetermined separation locations.