OLED Encapsulation Adhesion via Cathode Via Holes
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Solution Overview
Problem
OLED display panels are sensitive to moisture and oxygen, leading to weak adhesion between the encapsulation layer and other film layers, which can cause the encapsulation layer to fall off, reducing the service life of the device.
Innovation Solution
Incorporating via holes in the cathode and organic flat layers on the non-display area, allowing the encapsulation layer to make direct contact with both, increasing the contact area and enhancing adhesion, thereby reducing the likelihood of the encapsulation layer detaching and improving the panel's ability to block water and oxygen.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the encapsulation layer is applied directly on the OLED device without via holes, then the structure is simple and manufacturing is easier, but the adhesion between the encapsulation layer and other film layers is weak, causing the encapsulation layer to fall off
Solution Approach 1:
The patent applies via holes (porous structures) in the cathode and organic flat layers to enable the encapsulation layer to contact multiple underlying layers simultaneously. This porous approach increases the contact area and adhesion strength without requiring completely new materials, resolving the contradiction between adhesion strength and structural simplicity.
2Reliability
If the encapsulation layer is applied directly on the OLED device, then the manufacturing process is simpler, but moisture and oxygen can invade the OLED device, reducing service life
Solution Approach 1:
The patent segments the encapsulation layer into multiple sections that contact different underlying layers (cathode, organic flat layer, and both) through via holes. This segmentation allows the encapsulation layer to provide better protection against moisture and oxygen penetration while maintaining a relatively simple manufacturing process by using existing layer structures.
3Stability of the object's composition
If via holes are added to increase contact area, then adhesion is improved and encapsulation layer stability is enhanced, but the device structure becomes more complex
Solution Approach 1:
The via holes serve multiple functions simultaneously: they increase the contact area for adhesion, provide pathways for the encapsulation layer to bond with multiple layers, and enhance the overall structural stability. This multi-functionality reduces the need for additional separate structures, thereby limiting the increase in device complexity while achieving improved stability.
Data Source
AI summary
An organic light emitting diode (OLED) display panel and a display device are provided. The OLED display panel includes a substrate and an organic flat layer, a cathode, and an encapsulation layer stacked on the substrate. The substrate includes a display area and a non-display area. The cathode located on the non-display area includes at least one first via hole, and the encapsulation layer is in contact with the organic flat layer through the at least one first via hole.