OLED Planarizing Layer CMP for Color and Luminance Uniformity

The patent applies preliminary action by forming the planarizing layer structure (including organic insulating layer and inorganic insulating layer) before forming the light emitting layer, and performing CMP processing on the planarizing layer to achieve the required surface roughness of 50 nm or less before the light emitting layer is deposited. This ensures the surface is properly prepared in advance to prevent color and luminance non-uniformity.

The patent replaces the photolithography process with CMP (chemical mechanical polishing) to planarize the surface of the planarizing layer. Instead of using photosensitive resin and photolithography which cause surface unevenness, the patent uses CMP processing to mechanically and chemically polish the organic insulating layer and inorganic insulating layer to achieve a surface roughness of 50 nm or less, thereby eliminating the surface unevenness problem.

The patent uses CMP (chemical mechanical polishing) which involves slurry flow and mechanical contact to planarize the surface of the planarizing layer. The slurry is applied and removed through a polishing head that contacts the surface, using a combination of chemical reaction and mechanical abrasion to achieve the required surface roughness of 50 nm or less, ensuring uniform light emission without directional scattering.