OLED Display COF Bending and PCB Overlap for Length Reduction
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Solution Overview
Problem
The existing OLED display structures with chip on film (COF) and printed circuit board (PCB) configurations result in increased overall length, making it difficult to enhance battery capacity and achieve a thin-profile in electronic devices, such as portable terminals and laptops, due to the adhesion tape, integrated circuit chip, and pad unit alignment along a single direction.
Innovation Solution
The OLED display design features a COF bent towards the non-luminescent surface of the display panel, with a PCB positioned outside, overlapping with the COF, and utilizing adhesive tapes to fix both components securely, allowing for a reduced overall length by creating an opening in the PCB for the integrated circuit chip and mounting electronic devices between the pad unit and the chip, thereby minimizing the combined length of the COF and PCB.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the chip on film and PCB are aligned in a single direction with adhesion tape, integrated circuit chip, and pad unit in sequence, then the electrical connection and component mounting are simplified, but the overall length increases making it difficult to enhance battery capacity and achieve thin-profile devices
Solution Approach 1:
The patent transitions from a one-dimensional linear arrangement to a two-dimensional overlapping configuration. The PCB is positioned to overlap with the COF in the vertical direction, allowing electrical connections to be made in multiple spatial dimensions rather than requiring a long linear sequence, thereby reducing the overall length while maintaining manufacturing simplicity
Solution Approach 2:
The patent implements a nested arrangement where the PCB is positioned within the vertical space occupied by the COF structure. The opening in the PCB allows the integrated circuit chip to be received within the overlapping region, creating a compact nested configuration that reduces the projected length while maintaining all necessary electrical connections
2Length of moving object
If the PCB is positioned to overlap with the chip on film, then the overall length is reduced to increase battery capacity and achieve thin-profile, but the component mounting area and electrical connection complexity increase
Solution Approach 1:
The patent divides the overlapping region into distinct functional zones: an opening region for receiving the integrated circuit chip, a pad unit region for electrical connections, and a component mounting area. This segmentation allows each region to perform its specific function efficiently, reducing overall structural complexity despite the overlapping configuration
Solution Approach 2:
The patent applies different structural characteristics to different regions of the PCB and COF. The opening area provides access for the integrated circuit chip, the pad unit area provides electrical connection points, and the component mounting area provides space for additional components. This localized differentiation simplifies the overall design by giving each region a specific optimized function
Data Source
AI summary
An organic light emitting diode (OLED) display including a display panel, a chip on film, and a printed circuit (PCB) is disclosed. In one embodiment, the display panel includes a display area having an OLED and a pixel circuit, and a pad area in an outer side of the display area. The chip on film is connected to the pad area, is bent toward a non-luminescent surface of the display panel, and include an integrated circuit chip. The PCB includes at least a part overlapping with the chip on film in an outer side of the non-luminescent surface of the display panel, and an opening for receiving the integrated circuit.