OLED Chip on Film Spacer for Attachment Force and Heat Dissipation
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Solution Overview
Problem
Existing OLED displays face challenges in attachment force of the chip on film to the base substrate, susceptibility to damage from external forces leading to short-circuits, and inadequate heat dissipation of the driving integrated circuit.
Innovation Solution
Incorporation of a spacer with a thermal conductive layer and adhesive layer on the chip on film, which is bent to increase attachment force and act as a reinforcing element, and is designed to match the thickness and width of the protection and printed circuit boards, enhancing heat dissipation by using materials with thermal conductivity greater than 0.7 W/(mk).
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the chip on film is directly attached to the base substrate without additional support structures, then the device complexity is reduced, but the attachment force is insufficient and the chip is susceptible to damage from external forces
Solution Approach 1:
The patent introduces a spacer as an intermediary component between the chip on film and the base substrate. This spacer provides mechanical support and enhances attachment force without requiring complex integration structures. The spacer acts as a mediator that distributes stress and prevents direct stress concentration on the chip, thereby improving strength while maintaining relatively simple device architecture.
Solution Approach 2:
The spacer is constructed using composite materials with specific thermal conductivity requirements (greater than 0.7 W/(mk)). This composite structure combines mechanical support functionality with thermal management capabilities, allowing the spacer to simultaneously improve attachment strength and heat dissipation without adding significant structural complexity.
2Reliability
If the chip on film is made more robust to resist external forces, then the reliability against short-circuits is improved, but the heat dissipation capability deteriorates due to additional insulating layers
Solution Approach 1:
The patent specifies precise parameter ranges for the spacer, including thermal conductivity greater than 0.7 W/(mk) and specific thickness requirements. By carefully controlling these parameters, the spacer provides mechanical protection and reliability while maintaining effective thermal conduction. The parameter optimization ensures that the protective function does not come at the cost of heat dissipation performance.
Solution Approach 2:
The use of composite materials with tailored thermal conductivity properties allows the spacer to simultaneously provide mechanical strength for short-circuit prevention and thermal pathways for heat dissipation. The composite structure combines materials with complementary properties to achieve both reliability and thermal management.
3Device complexity
If the driving integrated circuit is placed closer to the chip on film to reduce connection length, then the device complexity is reduced, but the heat dissipation efficiency deteriorates due to increased thermal coupling
Solution Approach 1:
The spacer serves as a thermal intermediary between the driving integrated circuit and the chip on film. While it provides mechanical support and structural integration, its thermally conductive properties enable efficient heat transfer from the integrated circuit to the base substrate. This mediator approach allows close placement for reduced complexity while maintaining thermal management through the spacer's conductive pathway.
4Strength
If the spacer thickness is increased to improve attachment force, then the mechanical strength is improved, but the overall device thickness increases and manufacturing precision requirements worsen
Solution Approach 1:
The patent defines specific thickness parameters for the spacer to optimize the balance between attachment force and manufacturing feasibility. By establishing precise parameter ranges, the design achieves sufficient mechanical strength while maintaining compatibility with standard manufacturing tolerances. The parameter specification ensures that the spacer is thick enough to provide support but not so thick as to create excessive manufacturing challenges.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively increases the attachment force of the chip on film, prevents short-circuits, and improves heat dissipation, ensuring reliable operation and preventing overheating of the driving integrated circuit.
Implementation Method 1
The thermal conductive layer may have thermal conductivity of greater than about 0.7 W/(mk)
Implementation Method 2
The adhesive layer may include a thermally conductivity acrylic adhesive
Data Source
AI summary
An organic light emitting diode (OLED) display is disclosed. In one embodiment, the OLED display includes: an organic light emitting display panel including i) a base substrate having a pixel area and a pad area and ii) a protection substrate connected to the base substrate to cover the pixel area, wherein the pad area is formed outside of the pixel area and adjacent to an edge of the base substrate. The OLED display also includes a printed circuit board formed on the protection substrate and a chip on film including i) a first terminal electrically connected to the pad area, ii) a second terminal electrically connected to the printed circuit board and iii) a bending portion bent from the first terminal toward the second terminal. The OLED display further includes a spacer formed on the first terminal, wherein the spacer is located inside of the bending portion.