OLED Packaging With Concave Covering Layer for Sealing
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Solution Overview
Problem
OLED display devices are sensitive to air and humidity, leading to deterioration of organic light-emitting materials and metal electrodes, which affects their stability and lifespan, and existing packaging technologies using resin or glass cement do not provide an ideal sealing solution.
Innovation Solution
A method for packaging OLED display panels involves forming a concave structure on the substrate and a convex structure on the cover plate, with an adhesive accommodated in the recess of the concave structure, using a silicon-containing oxide covering layer and a low-melting-point material, and bonding the substrate and cover plate together with sintering and auxiliary adhesive application.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If resin or glass cement is used to bond the backplate and cover plate, then bonding is achieved, but the packaging effect is not ideal due to poor sealing performance
Solution Approach 1:
The patent applies preliminary action by pre-forming the covering layer with a concave structure on the backplate before bonding. This pre-structured design prepares the surface to receive and contain the adhesive, ensuring optimal sealing performance from the outset rather than relying on adhesive alone to create effective packaging.
Solution Approach 2:
The patent introduces the covering layer with concave structure as an intermediary element between the backplate and cover plate. This intermediate structure holds the adhesive in a controlled manner, improving the bonding interface and overall packaging effect compared to direct adhesive application.
2Strength
If adhesive is applied extensively to ensure bonding, then bonding strength is improved, but air and water vapor permeation increases
Solution Approach 1:
The patent applies local quality by creating a concave structure in specific locations on the covering layer where adhesive needs to be positioned. This localized structural modification ensures adhesive is concentrated where needed for bonding strength while preventing excessive adhesive spread that would create permeation pathways for air and water vapor.
Solution Approach 2:
The covering layer acts as a flexible thin film structure that can be precisely formed with concave regions. This thin film approach provides both mechanical bonding support and environmental barrier functions, controlling adhesive placement to maintain sealing integrity against air and moisture penetration.
3Ease of manufacture
If conventional packaging methods are used, then manufacturing is simple, but sintering requires high energy and time
Solution Approach 1:
The patent applies parameter changes by modifying the physical structure of the covering layer to include concave regions. This structural parameter change alters how adhesive interacts with the surface, enabling effective bonding at lower sintering temperatures and shorter times compared to conventional flat-surface packaging methods.
Solution Approach 2:
By pre-forming the concave structure in the covering layer before bonding, the patent prepares the surface to enhance adhesive contact and heat transfer efficiency during sintering. This preliminary structural preparation reduces the energy and time required for the actual bonding process while maintaining manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces air and water vapor permeation, enhances bonding strength, and improves sintering efficiency with lower energy and time requirements, while preventing oxidation and corrosion of metal electrodes, thereby increasing the stability and lifespan of OLED display devices.
Implementation Method 1
a recess of the concave structure corresponds to the adhesive in location and size so that the adhesive is accommodated in the recess
Implementation Method 2
bonding the substrate and cover plate together with sintering
Implementation Method 3
using a silicon-containing oxide covering layer and a low-melting-point material
Data Source
AI summary
The present disclosure relates to a method for packaging an OLED display panel, an OLED display panel and an OLED display device. The method for packaging an OLED display panel comprises: providing a substrate and a cover plate, and forming a covering layer on the substrate, wherein the covering layer has a concave structure. The method further comprises forming another covering layer having a convex structure or forming an adhesive on the cover plate, wherein a bump of the convex structure or the adhesive may be accommodated in a recess of the concave structure.