OLED Device Conductive Carrier Substrate Insulation Holes
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Solution Overview
Problem
The manufacturing of OLED devices using conductive carrier substrates poses challenges due to electrical conductivity issues that can lead to short circuits, requiring complex and costly insulation methods to prevent interference with other functional layers, limiting material choices and increasing layer thickness, especially for large-area devices.
Innovation Solution
A method involving a conductive carrier substrate with a patterned insulating layer and conductive coating, where the insulating layer has holes allowing electrical access and the conductive coating forms discrete electrode areas in contact with the substrate, enabling equal current distribution across the electrode area, and an organic light-emitting layer is applied on top, with a second electrode layer sealing the device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a non-conductive coating is applied over the complete surface of the carrier substrate, then electrical insulation is achieved, but the layer structure becomes thicker and material choices are limited
Solution Approach 1:
The patent applies local quality by creating holes only in specific regions where electrical contact is needed, rather than making the entire insulating layer non-conductive. This allows the insulating layer to maintain its insulation function overall while providing localized electrical access points to the conductive carrier substrate, thereby reducing the need for thick uniform insulation layers.
Solution Approach 2:
The insulating layer is segmented by creating multiple holes through it, dividing the continuous insulating structure into regions separated by these openings. This segmentation allows selective electrical contact at specific locations while maintaining insulation elsewhere, reducing the overall complexity and thickness requirements of the insulating structure.
2Reliability
If an inorganic material is deposited as the contact pad, then galvanic insulation is achieved, but the deposition process is costly and ineffective
Solution Approach 1:
The patent uses the conductive carrier substrate itself as an intermediary to provide electrical contact through the holes in the insulating layer, eliminating the need for separate inorganic contact pad materials. The carrier substrate acts as the mediating element that provides both mechanical support and electrical conductivity where needed, simplifying the manufacturing process.
Solution Approach 2:
The patent changes the electrical conductivity parameter of the carrier substrate by creating selective openings in the insulating layer, transforming it from a completely insulating structure to one with controlled conductive regions. This parameter change allows the use of the existing conductive carrier substrate material rather than requiring additional inorganic contact pad materials.
3Ease of manufacture
If organic insulators are used, then coating flexibility is improved, but moisture barrier function is lost leading to operational defects
Solution Approach 1:
The patent employs a composite structure combining an insulating layer with selective hole regions, creating a material system that exhibits both insulation properties and controlled conductivity. This composite approach allows the insulating layer to maintain its flexibility and coating advantages while the strategic openings provide the necessary electrical access without compromising the overall moisture barrier function of the insulated regions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows the effective use of conductive carrier substrates for power supply contact, ensuring equal current distribution and preventing short circuits, facilitating the production of larger OLED devices with reduced coating steps and material limitations, while maintaining device flexibility and moisture resistance.
Implementation Method 1
the conductivity of the carrier substrate is not used for transporting current... at least one discrete first electrode area is in galvanic contact with the conductive carrier substrate via a plurality of holes
Implementation Method 2
assembling on at least the first carrier surface a patterned layer of insulating material... ensuring equal current distribution and preventing short circuits
Implementation Method 3
a direct current flows from one electrode to the other, thereby passing through the light-emitting layer which then, again, emits light
Data Source
Figure 1~5
Figure 6~7
AI summary
The invention describes a method of manufacturing an OLED device (1). This method comprises the steps of providing an electrically conductive carrier substrate (3) with a first carrier surface (3a) and a second carrier surface (3b), assembling at least the first carrier surface (3a) a patterned layer of insulating material (5) over an integral area, the layer of insulating material (5) being patterned by a plurality of holes (7) such that an electric access to the first carrier surface (3a) is possible from an upper surface (10) of the layer of insulating material (5) facing away from the first carrier surface (3a), assembling a patterned conductive coating (8, 9) on the insulating material (5) at its upper surface (10) such that the conductive coating (8, 9) enters the holes (7) and covers the insulating material (5) over an integral area, whereby the conductive coating (9) is patterned such that a number of discrete first electrode areas (11) are formed in the conductive coating (9), applying an organic light- emitting layer (13) above at least one first electrode area (11), applying a second electrode layer (15) above the organic light emitting layer (13). The invention also describes a semi-finished product (21) in such process and an OLED device (1) manufactured in such process.