OLED Conductor Contact via Ultrasonic Welding Through Encapsulation
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Solution Overview
Problem
The existing methods for contacting OLED devices with conductors are costly and inefficient due to the need for masking processes that cause yield losses and require expensive systems to prevent encapsulation deposition on contact regions.
Innovation Solution
A method that allows direct interconnection of conductors with contact regions through the encapsulation using ultrasonic welding, eliminating the need for prior removal of encapsulation and masking processes, with the encapsulation comprising inorganic materials like silicon nitride applied via CVD and the conductor being a metal wire.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a masking process is used to prevent encapsulation deposition on contact electrodes, then the encapsulation can be applied, but the manufacturing cost increases and yield losses occur due to mask handling and particle generation
Solution Approach 1:
The patent extracts and removes the masking step from the encapsulation process. By using a deposition technique that inherently avoids depositing material on the contact electrodes (such as shadow mask-free deposition or selective area deposition), the patent eliminates the need for separate masking layers, mask handling, and associated particle contamination risks, thereby reducing manufacturing cost while maintaining encapsulation integrity
Solution Approach 2:
The patent applies preliminary protection to the contact electrodes before encapsulation deposition by applying a protective coating or using a deposition method that naturally excludes the contact electrode area. This preliminary action prevents the need for subsequent masking and demasking steps, reducing both cost and yield losses from mask handling
2Reliability
If a masking process is used to prevent encapsulation deposition on contact electrodes, then the encapsulation can be applied, but the manufacturing complexity increases due to expensive masking systems
Solution Approach 1:
The patent removes the masking system from the encapsulation process entirely by using a deposition technique that can selectively deposit encapsulation material only on the OLED active area while naturally avoiding the contact electrodes. This extraction of the masking step simplifies the overall manufacturing system and eliminates the need for expensive mask handling equipment
Solution Approach 2:
Instead of using a masking approach that blocks deposition from reaching contact electrodes, the patent inverts the approach by using a deposition method that inherently targets only the desired deposition area (OLED active area) and automatically excludes the contact electrode regions, thereby eliminating the need for complex masking systems
3Reliability
If the encapsulation is removed between conductor and contact region, then electrical connection can be established, but additional process steps are required increasing manufacturing cost and time
Solution Approach 1:
The patent merges the encapsulation deposition and conductor connection steps into a single integrated process. By using a deposition technique that allows the conductor to be deposited directly onto the contact electrode area without requiring prior encapsulation removal, the patent combines what were previously separate steps (encapsulation deposition, encapsulation removal, conductor deposition) into one continuous process, thereby improving manufacturing efficiency and productivity
Solution Approach 2:
The patent applies preliminary preparation to the contact electrode area that enables direct conductor deposition without requiring subsequent encapsulation removal. This preliminary action (such as surface treatment or selective area preparation) ensures that the conductor can be directly connected to the contact region through the encapsulation layer, eliminating additional process steps and improving manufacturing efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method provides a cost-effective and efficient electrical connection to OLED devices without the need for expensive masking systems, ensuring protection against environmental penetration while maintaining the integrity of the encapsulation.
Implementation Method 1
interconnecting the conductor with the contact region comprises ultrasonic welding
Implementation Method 2
the ultrasonic welding energy melts the conductor and the contact region, thereby creating the joint
Implementation Method 3
frequently applied via a vacuum deposition process like plasma enhanced chemical vapor deposition (CVD)
Data Source
AI summary
Disclosed is a method for contacting a device with a conductor 6, the device 1 comprising a substrate 2 with at least one cell 3, a contact region 4 and an encapsulation 5, wherein the encapsulation 5 encapsulates at least the contact region 4, the method comprising the steps of arranging the conductor 6 on the encapsulation 5, and interconnecting the conductor 6 with the contact region 4 without removing the encapsulation 5 between the conductor 6 and the contact region 4 beforehand. This invention is advantageous as the encapsulation 5 between the conductor 6 and the contact region 4 does not need to be removed beforehand anymore.