OLED Module Copper Foil FPC Integration
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Solution Overview
Problem
Conventional organic light emitting diode (OLED) modules have high costs and thickness due to the use of flexible printed circuit boards and connectors, which increase assembly costs and hinder the achievement of uniform brightness.
Innovation Solution
The OLED module employs a substrate with a first electrode, second electrodes, a light emitting element, first and second copper foils, and a cross connection conductor, allowing for connection to a power supply with only two conductive wires, eliminating the need for connectors and reducing material costs and thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If four flexible printed circuit boards and connectors are used to connect electrodes, then uniform brightness is achieved, but the module thickness increases and cost increases
Solution Approach 1:
The patent removes the flexible printed circuit board connectors from the system entirely. Instead of using four separate connectors to connect electrodes to FPCs, the invention integrates the electrode connections directly to the FPC through conductive adhesive, eliminating the need for discrete connectors and thereby reducing module thickness.
Solution Approach 2:
The patent merges the electrode and FPC connection functions into a single integrated structure. The copper foils serve both as electrical conductors and as connection elements to the FPC, combining multiple functions (electrode connection, electrical conduction, and mechanical attachment) into unified components that reduce overall complexity and thickness.
2Reliability
If four flexible printed circuit boards and connectors are used, then electrode connections are established, but assembly cost increases
Solution Approach 1:
The patent combines multiple functions into unified components: copper foils serve as both electrical conductors and mechanical connection elements to the FPC. This merging reduces the number of discrete parts (eliminating connectors) and simplifies the assembly process, thereby reducing assembly cost while maintaining reliable electrical connections through conductive adhesive.
Solution Approach 2:
The patent extracts and removes the expensive connector components from the assembly. By eliminating the need for four separate FPC connectors and their associated assembly steps, the invention significantly reduces material costs and assembly complexity while maintaining reliable electrode connections through the integrated copper foil-FPC structure.
3Reliability
If four conductive wires and flexible printed circuit boards are used, then electrodes are connected, but material cost increases
Solution Approach 1:
The patent merges the functions of conductive wires and connectors into integrated copper foil structures that are directly bonded to the FPC. This consolidation reduces the quantity of materials needed (fewer discrete wires and connectors) while maintaining excellent electrical conductivity through the large surface area contact between copper foils and FPC via conductive adhesive.
Solution Approach 2:
The patent extracts and eliminates the need for four separate conductive wires and four FPC connectors. By integrating the connection function directly into the FPC structure through conductive adhesive-bonded copper foils, the invention reduces material quantity and cost while preserving reliable electrical conductivity pathways.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves uniform brightness with reduced material and assembly costs, and decreases the module's thickness by eliminating connectors, while maintaining efficient conductivity and extending the module's lifespan.
Implementation Method 1
When power is provided to the anode and cathode conductive layers, the organic light emitting layer can emit light.
Implementation Method 2
The conductive adhesive adheres the third copper foil and the second copper foils.
Data Source
AI summary
An organic light emitting diode module is provided and includes a substrate, a first electrode located on the substrate, a pair of second electrodes located on the substrate, a light emitting element located on the substrate, a first copper foil electrically connected to the first electrode, a pair of second copper foils respectively electrically connected to the second electrodes, and a cross connection conductor electrically connected to the second copper foils. The second electrodes are in an arrangement opposite to one another. The light emitting element includes a first electrode layer electrically connected to the first electrode, a second electrode layer located between the second electrodes and electrically connected to the second electrodes, and an organic light emitting layer located between the first and second electrode layers.