OLED Packaging Cover Plate Structure for Low-Sintering Sealing
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Solution Overview
Problem
The existing OLED display panel packaging methods are inadequate as they result in a large sintering area, leading to the release of heat and water vapor which can damage the organic light-emitting material, reducing the quality and lifespan of the display component.
Innovation Solution
A display panel design featuring a packaging cover plate with an air cushion layer and a packaging layer having a concave structure, which reduces the contact area with the cover plate substrate, and a barrier layer with specific concave structures to minimize sintering, along with a spacer layer and sealant frame to enhance airtightness, thereby reducing the sintering area and exposure to water and oxygen.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a packaging layer covers the display component and is sintered to the glass cover plate and base substrate, then packaging effect is improved, but sintering area becomes large causing heat and water vapor release that damages the display component
Solution Approach 1:
The packaging layer is divided into multiple separate packaging regions corresponding to different display components, rather than forming a continuous large-area packaging layer. Each packaging region is independently sintered to the base substrate, segmenting the sintering area into smaller zones that generate less heat and water vapor per region.
Solution Approach 2:
The packaging layer uses different materials for different regions: an inorganic packaging layer (such as aluminum oxide or silicon oxide) directly contacts the display component for optimal protection, while an organic packaging layer provides additional sealing. This local differentiation allows each region to be optimized for its specific function while controlling overall sintering impact.
2Reliability
If the packaging layer is sintered to the glass cover plate and base substrate, then sealing is improved, but the sintering process releases heat and water vapor that adversely affect the organic light-emitting material
Solution Approach 1:
The organic light-emitting material is completely formed and cured before the packaging layer sintering process begins. This preliminary completion of the sensitive material layer ensures that subsequent sintering operations do not expose the organic material to prolonged high temperatures, reducing thermal damage while maintaining sealing integrity.
Solution Approach 2:
The sintering process is optimized to complete sealing rapidly through targeted localized sintering of packaging regions, minimizing the duration of heat exposure. By rushing through the critical sealing phase quickly and then reducing heat input, the process achieves necessary sealing while limiting cumulative thermal damage to the display component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design minimizes the adverse effects of sintering on the display component by reducing heat and water vapor release, enhancing the packaging efficiency and longevity of the OLED display panel.
Implementation Method 1
an air cushion layer formed on the cover plate substrate
Implementation Method 2
the packaging layer is sintered and fixed to the cover plate substrate... the packaging layer is sintered and fixed to the base substrate on the periphery of the display component
Implementation Method 3
a material of the barrier layer comprises SiOx or a SiOx composite
Data Source
AI summary
An embodiment of the present disclosure provides a display panel, comprising a display substrate and a packaging cover plate that are oppositely arranged to form a cell, in which the packaging cover plate comprises a cover plate substrate, an air cushion layer formed on the cover plate substrate, and an packaging layer covering the air cushion layer and having a first concave structure, the display substrate comprises a base substrate and a display component formed on the base substrate and embedded in the first concave structure.


